HB05
Flexible Manual Wire Bonder
The
HB05 Flexible Manual Wire Bonder is an advanced bench-top
system for ultrasonically bonding gold or aluminium wire using
either wedge or ball bonds (setup dependant).
The system is operator controlled and
is capable of wire bonding 17 through 50 micron wire diameters
or ribbon bonding up to 25 x 250 micron. The conversion
between ball bonding and wedge bonding takes less than 5 minutes.
The
HB05 Flexible Manual Wire Bonder is very simple to set-up
and operate. For ease of use the system incorporates
a sophisticated control panel, where the machine configuration,
status and bonding parameters can be adjusted.
HB05
Flexible Manual Wire Bonder System Features:
- 17
– 50µ Wire Diameters
- Up
To 25 x 250µ Au Ribbon
- Simple
Control Panel For User Adjustments
- 90°
Deep-access Bonding
- PLL
Control Ultrasonic Generator
- Wire
Wedge and Ribbon Bonding
- Multiple
Stitch Bonding Option
- Bond
Arm Length 165 mm
- Built-in
Dual Fibre Optic Illuminator
- Built-in
Heated Stage Controller
- 6:1
Ratio X-Y Manipulator
- Motorised
2” Wire Spool
- Electronic
Touch-Down Control
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PDF
Datasheet (590Kb)