| TPT
- Manual to Semiautomatic Flexible Wire Bonding Equipment
TPT
of Germany, manufacture the HB series of modern, semi-automatic,
bench mounted wire bonders, which feature 90° vertical wire
feed and are convertible between gold ball bonding & aluminium
or gold wedge bonding for ribbon or wire.
The
TPT gold wire bonders and aluminium wire bonding systems are very
easy to operate and are ideal for universities, development laboratories
through to medium volume production facilities.
The
wire bonder model range comprises the entry level Manual HB01 Series,
The Semi-Manual HB10 Series, to the feature rich HB16 Series.
TPT
Model Range Overview:
HB05
Flexible Manual Wire Bonding Series
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HB02
Wedge Bonder
For wedge bonding of gold or alumnium wire or ribbon |
Detailed
Overview & Datasheets |
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HB04
Gold Ball Bonder
Manual gold ball wire bonder
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HB05
Flexible Wire Bonder
Interchangeable between either ball or wedge bonding
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HB10
Flexible Semi-Manual Wire Bonding Series
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HB06
Wedge Bonder
Semi-manual wire bonder for wedge bonding of wire or ribbon
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Detailed
Overview & Datasheets |
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| HB08
Ball Bonder
Semi-manual wire bonder for gold ball wire bonding
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| HB10
Flexible Wire Bonder
Interchangeable between either ball or wedge bonding |
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HB16
Flexible Semi-Automatic Wire & Die Bonding Series
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HB12
Wedge Bonder
Semiautomatic wire bonder for wedge bonding of wire or ribbon
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Detailed
Overview & Datasheets |
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| HB14
Ball Bonder
Semiautomatic wire bonder for gold ball wire bonding |
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| HB16
Flexible Wire Bonder
Interchangeable
between either ball or wedge bonding |
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HB16D
Flexible Die & Wire Bonder
Interchangeable
between either ball or wedge bonding & die bonding! |
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