Inseto
Microelectronic Equipment Division
Inseto's Equipment Division provides manufacturing equipment for the Microelectronic, Photonic, Nanoelectronic, Solar Cell and Semiconductor industries including probing systems, dicing and scribing machines, die and wire bonders, plasma cleaners, ovens & vacuum soldering systems, material testers for pull & shear testing, microscopes, automatic inspection systems for wafers and high power test systems etc.
Full technical support including process, operation and maintenance is provided, with extensively trained field personnel and information databases. Training either at Inseto's training facility or onsite, can be provided to maximise equipment productivity and optimise quality of results.
| ADVANCED DICING TECHNOLOGIES - A.D.T. | A world leader
in the development and manufacture of dicing saws, laser scribing
systems & blades used in the dicing of Silicon-based Semiconductor
Wafers and hard materials including Glass, Ceramics, Ferrites,
MEMS and in Package Singulation |
| 7100 Series Semi-automatic Dicing Saws | |
| 7200 Series Fully Automatic Dicing Saws | |
| 7900 Dual Spindle Dicing Saws | |
| 8000 Laser Scribing System | |
| Peripheral Dicing Equipment: Wafer Washing, Wafer Mounting, Chillers etc. | |
| AMADYNE | Flexible microelectronic
pick & place systems, die bonding equipment and die sorting
machines in manual-inline configurations. Automation systems
for Microelectronics assembly processes including pick &
place, dispensing, UV & snap curing, eutectic soldering,
flip chip etc. |
| FAB - Fast Automatic Flexible Die Bonder | |
| ATV | Solder Reflow, Hot Plates,
Scribe Systems, Vacuum Ovens |
| Semiconductor Processing Furnaces | |
| Vacuum Soldering Systems | |
| High Precision Hot Plates | |
| CAMTEK | Automatic optical inspection
(AOI) systems for wafer-level inspection and analysis of flip
chip bumps, cut quality defects (Kerf) and wafer surface defects |
| Dr TRESKY | Manufacturers of high
quality equipment renowned for its exceptional ergonomics and
flexibility used for component pick and place and die bonding.
More recently Dr Tresky have also introduced a range of advanced
rework systems. |
| T-4909 Manual Die Bonder | |
| T-3000/2-M Flexible Manual Bonder | |
| T-3000/2-FC3 Semi-automatic Flip Chip / Die Bonder | |
| T-3000-RD High Force Capable Bonder | |
| R-SYSTEM 600 / 1200 Rework System | |
T-CHIPEX 1 Chip / Die
Removal System |
|
| FOCUSED TEST | ATE Component Test Manufacturer,
test capabilities include power discrete and analog IC ATE for
analog devices & high power devices with multi-site test
capability to MIL Standard 750 |
| KULICKE & SOFFA | K&S Manufacture modern
semi-automatic bench mounted wire bonders, for gold ball &
wedge bonding of ribbon or wire, automatic gold ball and bump
bonders and automatic die bonding and sorting equipment |
| K&S 4500 Series Manual Wire Bonders | |
| K&S Icon Automatic Ball Bonders | |
| K&S AT Premier™ Automatic Stud Ball Bumpers | |
| K&S iStack Automatic Die Bonding Equipment | |
| NORDSON-DAGE | Manufacturers of wire
bond testing equipment for pull test, bond shear and die shear,
stud pull, fine pitch shear testing with high accuracy, repeatability
and ease of use |
| Dage 4000Plus Advanced Bond / Materials Tester | |
| Dage Series 4000 Multi-purpose Bond Tester | |
| ORTHODYNE | Rotary head, ultrasonic
wedge wire bonding equipment for the semiconductor, automotive,
and industrial market |
| M20 - Manual Large Wire Bonders | |
| 3600Plus Automatic Large Wire Bonding Equipment | |
| 3700Plus Automatic Fine Wire Bondign Equipment | |
| PLASMA ETCH | Leading manufacturers of Plasma treatment, etching and cleaning systems, including entry level benchtop models through industrial to high volume continuous feed production equipment. |
| Benchtop Plasma Cleaners | |
| Industrial Plasma Cleaners & Etchers | |
| Inline & Reel-to-Reel Plasma Cleaners | |
| SEMIPROBE | SemiProbe is a global
supplier of manual to automatic probing and testing solutions
for microelectronics, MEMS, nanotechnology, chemistry, microfluidics,
optoelectronics, photovoltaics and more. |
| Manual Wafer Probers | |
| Probe System For Life PS4L - Modular Wafer Probers | |
| Semi-Automatic Modular Wafer Probers | |
| INSETO TECHNICAL SUPPORT | Technical Customer Services by highly skilled factory trained engineers providing: Application Engineering, Preventative Maintenance & Support Contracts, Emergency Breakdown Service, Training Courses, Process Assistance & Development, Annual Calibrations etc. All services are carried out and Certified in accordance with our ISO9001:2008 Accreditation. |
| Technical Support Services | |
