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MICROCERTEC
– Machined & Metalised Ceramics & Interconnection
Devices
Formed
by a management buy-out from Morgan Advanced Ceramics S.A.S., MICROCERTEC
has over 30 years history in producing precision ceramics, using
the latest in precision diamond grinding and micro-machining techniques.
Its policy of sustained development has resulted in an extended
workplace of 1,500 square metres, the latest CAD-CAM software and
CMM metrology equipment, and a quality system based on ISO 9001:2000.
MICROCERTEC’s modern and sophisticated equipment enables the
manufacture of high-quality ceramic devices using surface-, cylindrical-
and centreless diamond grinding, honing, milling-drilling, lapping
and polishing, as well as high-precision ultrasonic machining. A
dedicated ultrasonic cleaning facility, including a batch kiln that
allows parts to be clean-fired at temperatures up to 1,350°C,
ensures grit-free surface finishing to the highest standards.
Quality control is assured by metrology equipment such as height
gauges, optical and mechanical measuring machines, shadowgraph and
dye-tests, in dedicated air-conditioned rooms.
MICROCERTEC
ceramics find uses in such diverse applications as optoelectronics
& lasers, scientific & medical instrumentation, semiconductor
processing equipment, power electronics & microelectronics,
infra-red detectors, high-power laser diodes & vision systems,
aircraft & avionics, as well as research laboratories
Demanding end-use environments that MICROCERTEC supplies into include
ultra-high vacuums, corrosive gases & liquids, high electric
currents & voltages, nuclear radiation, extreme temperatures,
and high mechanical loads.
Materials: MICROCERTEC
offers a complete range of advanced ceramics, including multiple
grades of alumina, AlN including SHAPAL®, silicon carbide &
nitride, Zirconia, quartz, sapphire and MACOR®, as well as ferrites,
magnets, dielectric ceramics, and absorbing ceramics.
Product
Range Overview:
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3D
Interconnection Devices
These 3D interconnection devices are made with thin-film metalisation
and high-precision laser ablation techniques on ceramic carriers,
and provide excellent electrical insulation, high thermal
dissipation and superior dimensional stability. Tracks are
selectively laser-etched to 50µm width with 100µm
gaps, and metalisation of Ti/Pt/Au or Cr/Ni/Au is deposited
using PACVD technology.
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Lasers
& Optoelectronics
Insulators and structural parts made from advanced ceramics
retain full dimensional stability at temperatures in excess
of 1,000°C, thereby providing excellent resistance to
corrosive gases at sustained temperatures. Parts include thin
substrates, high-voltage insulators, and electrode tubes and
plates for ionisation chambers.
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Reflectors
for Lasers & Pulsed Light Systems
Highly reflective ceramics are used to amplify light intensity
in order to achieve a lasing effect. MICROCERTEC offers fully
and partially glazed alumina, which is porosity-controlled,
MACOR®, and quartz to exacting dimensions and finishes,
for use in YAG & solid-state lasers & pulsed-light
systems.
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Microelectronic
Substrates, Insulators & Dielectrics
Insulators, heat-sinks and circuit carriers made from advanced
ceramics are used to insulate and / or dissipate heat to
protect semiconductor & III-V die, while retaining excellent
dimensional stability over a wide temperature range. Uses
include high-frequency components and assemblies, sensors
and heat-sinks, and ceramic packages.
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Medical
& Scientific Instruments
Ceramic components are used in a wide variety of scientific
and medical instruments such as mass spectrometry, gas analysers,
particle accelerators, imaging equipment and blood analysers.
Typical parts include high-voltage insulators, heat dissipaters
and insulators, and support rings for quadropoles and hexapoles.
These applications predominantly use alumina (94 - 99.8%),
AlN, MACOR®, silica and Zirconia.
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Further
Information On Microcertec:
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Applications
/ Uses |
Microelectronics
Photonics
Scientific
& Medical Instrumentation
Aerospace
Measurement
& Control
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Industry
Segments: |
Military
Aerospace
Automotive
Telecommunications
Medical
Electronics
Fiber
Optics /
Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly etc.
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| Technical
Advice |
enquiries@inseto.co.uk |
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| Microcertec
Website |
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