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Advanced
Dicing Technologies Ltd (ADT) - Dicing Blades
ADT
manufacture a wide selection of annular dicing blades for your most
challenging applications. Their blade selection is comprised of
three product families distinguished by the type of binder: Resin-bond
Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades.
The
dicing blades are composed of abrasive materials embedded in either
resin or metal matrix. Resin-bond Blades are cured under pressure
and high temperature, Metal-bond Blades are sintered and Nickel-bond
Blades are manufactured using a tightly controlled electroforming
process.
Dicing
Blade Overview:
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Nickel
Bonded Dicing Blades
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The
Nickel binder provides longer blade life and lower wear
rate and together with the abrasive makes Nickel-bond
Blades a perfect choice for soft material applications
such as: PCB, Silicon and BGA
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Blade thickness varies from 0.8 mil to 20 mil (depending
on diamond grit size)
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Diamond grit size ranges from 2-4 microns to 70 microns
(depending on blade thickness)
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Resin as binder allows for blade wear management rendering
Resin-bond Blades an excellent choice for hard and brittle
materials such as: QFN/MLF, Thick Ceramic Substrates,
HTCC and Glass
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Resin
Blade thickness varies from 3 mil to 100 mil (depending
on diamond grit size)
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Diamond
grit size ranges from 3 microns to 250 microns (depending
on blade thickness)
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Metal-bond
(Sintered) Blades
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With slower wear rate than Resin but faster than Nickel,
Metal-bond (Sintered) blades are best suited for retaining
package shape and size in applications such as: BGA, Soft
Alumina, TiC, LTCC and Ferrite
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Blade thickness varies from 3 mil to 60 mil (depending
on diamond grit size)
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Diamond grit size ranges from 2 microns to 70 microns
(depending on blade thickness)
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Further
Information On A.D.T. Dicing & Scribing Technology:
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Applications
/ Uses |
Dicing
Semiconductor Wafers and Cutting Hard Materials
Cutting
Precision Metal Parts
Dicing
Thin Film Substrates
Cutting
Ferrites
Scribbing
& Dicing Ceramic
Cutting
Glass & Glass Filters
Dicing
MEMS
Package
Singulation etc.
PCB
Assembly Industries
Universities
Wafer Processing
Passive
Component Manufacturing
Medical Devices
Glass
Device Processing
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Industry
Segments: |
Semiconductor
Production
Military & Aerospace
Telecommunications
Medical Electronics
Fiber Optics / Photonics
Microwave Electronics
Microelectronics
Power Semiconductor Assembly
Semiconductor Back-end Assembly
PCB Assembly Industries
Universities
Passive Component Manufacturing
Medical Devices
Glass Device Processing
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| Technical
Advice |
enquiries@inseto.co.uk
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| A.D.T.
Website |
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