ATPCatalogue
1752Kb
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ATP
- Thin Film Metalised Substrates
ATP manufactures
high quality thin film circuits using a build-to-print service
with a wide range of materials and metalisation schemes. Circuits
are fabricated on substrates such as Alumina, Beryllia, AlN,
Fused Silica, Sapphire, and even on Silicon, with metalisations
from the standard TaN/TiW/Au to films including Nickel, Palladium,
or Titanium. Circuit features can include fine pitch conductors,
integrated resistors, vias, wraparounds, double-sided pattering,
and air-bridges.
ATP
has in-house capabilities in mask-making, sputtering, plating,
imaging, etching, and dicing. To facilitate customer development,
up to eight different design options can be produced with
a single mask. Prototype volumes can be as low as the quantity
on a single 50mm x 50mm (2” x 2”) substrate. Higher-volume
production is carrier out in state-of-the-art facilities in
North America or China.
Products
are manufactured to customer requirements for applications
that include RF, microwave & millimeter wave, fibre-optic,
and hi-rel products. Markets include wireless communications,
defense, aerospace and satellite communications, medical electronics,
and the fibre-optic industry. |
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Industry
Segments: |
Thin
Film Circuit Guidelines (173Kb) - This document defines the
design rules for the thin film circuits and applies to all
thin film circuits manufactured by Applied Thin-Film Products.
Laser
Resistor Trim Guidelines (177Kb) - This document defines the
design rules for laser trimming tantalum nitride resistors
on thin film circuits and applies to all laser-trimmed resistors
manufactured by Applied Thin-Film Products.
Polyimide Bridge Design Guidelines (56Kb) - This document
defines the design rules for polyimide bridges and applies
to all polyimide bridges manufactured by Applied Thin-Film
Products.
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