ATP - Thin Film Metalised Substrates

ATPCatalogue 1752Kb

ATP manufactures high quality thin film circuits using a build-to-print service with a wide range of materials and metalisation schemes. Circuits are fabricated on substrates such as Alumina, Beryllia, AlN, Fused Silica, Sapphire, and even on Silicon, with metalisations from the standard TaN/TiW/Au to films including Nickel, Palladium, or Titanium. Circuit features can include fine pitch conductors, integrated resistors, vias, wraparounds, double-sided pattering, and air-bridges.

ATP has in-house capabilities in mask-making, sputtering, plating, imaging, etching, and dicing. To facilitate customer development, up to eight different design options can be produced with a single mask. Prototype volumes can be as low as the quantity on a single 50mm x 50mm (2” x 2”) substrate. Higher-volume production is carrier out in state-of-the-art facilities in North America or China.

Products are manufactured to customer requirements for applications that include RF, microwave & millimeter wave, fibre-optic, and hi-rel products. Markets include wireless communications, defense, aerospace and satellite communications, medical electronics, and the fibre-optic industry.