DELO - Adhesives For Electronics Assembly

DELO manufacture a range of adhesives with low ionic levels for electronic applications, including glob-top encapsulants, dam / fill materials, flip chip underfill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining.

More information on DELO's entire range of adhesives can be found in our Adhesives Division.

Heat Cured Glob-Tops: DELO have introduced a new range of heat cured glob-top materials.  These exhibit low CTE's (< 20ppm), high Tg (>150 DegC) with curing schedules of 1hr max at 150Deg C.

Flip Chip Underfill - DELO offer both conductive and non-conductive underfills.  The conductive materials are both an underfill and an adhesive, enabling users to reduce the number of process steps and time, thereby reducing costs.

Light Activated Epoxies - DELO-KATIOBOND's are one-part solvent free, light activated, fast curing for use in opaque or translucent applications. They can be used for bonding, sealing and potting.

Light Cured Acrylics - DELO-PHOTOBOND's are one-part solvent free, high speed, light cured materials. They are highly flexible, optically clear, available with a wide viscosity range and can be used for bonding, sealing and potting.

Bonding

Glob-Top

Encapsulation

Z-Axis Bonding

Sealing

Potting

Underfill

Protection Against Vibration

Conductive Electrical Connection

Dam & Fill

Microelectronic / Hybrid Assembly

Semiconductor Assembly / Back-end Assembly etc.

Fiber Optics / Photonic Assembly

Microwave Electronics

OEM Equipment Manufacturers

Precision Components & Assemblies

PCB Assembly

Electronic Component / Device Assembly

Smart Cards

Smart Labels

enquiries@inseto.co.uk