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Cured Glob-Tops: DELO
have introduced a new range of heat cured glob-top materials.
These exhibit low CTE's (< 20ppm), high Tg (>150 DegC)
with curing schedules of 1hr max at 150Deg C.
Flip
Chip Underfill - DELO offer both conductive and non-conductive
underfills. The conductive materials are both an underfill
and an adhesive, enabling users to reduce the number of process
steps and time, thereby reducing costs.
Light
Activated Epoxies - DELO-KATIOBOND's
are one-part solvent free, light activated, fast curing for
use in opaque or translucent applications. They can be used
for bonding, sealing and potting.
Light
Cured Acrylics - DELO-PHOTOBOND's are one-part solvent
free, high speed, light cured materials. They are highly flexible,
optically clear, available with a wide viscosity range and
can be used for bonding, sealing and potting.
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