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Kulicke
& Soffa - Bonding Tools & Dicing Blades
K&S
Micro-Swiss is the worlds leading manufacturer of advanced bonding
tools, including capillaries for a broad range of applications from
standard to ultra fine pitch, wedge tools for small wire bonding,
single point TAB bonding tools, die attach collets and die bond
tools, with customs tools also available on request. The Micro-Swiss
product range is designed to suit all major brands of wire bonding,
die bonding and TAB bonding equipment.
K&S
Semitec offers a full range of hub dicing blades for a variety of
advanced material applications. Nearly three decades of experience
in sophisticated blade technology have shown that meeting the desired
objectives for cut quality, throughput and blade life requires matching
the material to be cut with the appropriate blade composition and
geometry.
Product
Range Overview:
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Ball
Bond Capillaries
K&S produce an extensive range of capillaries for Au &
Cu wire, from large pitch (120 µm pad pitch) through
ultra fine pitch (35-50 µm) applications. K&S capillaries
are continuously developed to improve bond process reliability,
equipment performance, looping characteristics, longevity
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Ultrasonic Wedge Bonding Tools
K&S
manufactures a complete line of standard and custom wedge
tools to fit all applications, including fine pitch bonding
for all types of bonding platforms. Their wedge tools are
selected or specially designed to meet customers' specifications
for bond length, shape, surface finish, front & back radius
and other criteria affecting bond location, strength and looping.
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Die
Bonding Tools & Collets
K&S
bonding tools include die collets and pick up tools, manufactured
from various metallic (stainless steel, tungsten carbide or
titanium carbide) and non-metallic (PVC, MSP, Vespel or Derlin)
materials to suit almost any application including eutectic
bonding. |
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Hub
Dicing Blades
K&S
Semitec produce high-quality hubbed dicing blades for package
and wafer singulation, which incorporate the latest technology
developed by K&S to enhance lifetime, cut quality and
process stability.
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Further
Information On Kulicke & Soffa
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Applications
/ Uses |
Wire
Bonding
Die
Bonding
Tab
Bonding
Eutectic
Die Attach
Dicing
and Scribing Wafers
Flip
Chip Bump Bonding
Die
Sorting
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Industry
Segments: |
Military
Aerospace
Automotive
Telecommunications
Medical
Electronics
Fiber
Optics /
Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly etc.
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| Technical
Advice |
enquiries@inseto.co.uk |
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| KnS
Website |
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