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Microelectronics Equipment Division

Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.

       

 

 

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Koartan - Thick Film Conductors

 

Gold Conductors

PDF

Part #

Type

Description

Download

4100

Au Bondable

Gold wire bondable paste for multilayering & general use

Download

4101

Au Via Fill

Gold via fill conductor for small & large via holes

Download

4225

Al Bondable

Aluminium wire bondable gold, compatible with 5807 dielectric

Download

4496

Solderable

Top layer solderable gold with good aged adhesion

Download

4540

Plug

Very high solids paste for plugging holes in the substrate

Download

4550

Etchable

Etchable gold with excellent fired density, wire bondable

Download

4583

Speciality

Ultra thin-print, laser trimable, firing up to 1050°C

Download

4586

Speciality

Thin-printing, economical solderable gold

Silver Conductors

PDF

Part #

Type

Description

Download

6101

Ag Via Fill

Low shrinkage paste for filling dielectric vias

Download 6107 Silver Conductor For Terminations on Chip & Netword Resistors

Download

6111

100% Ag

High speed printing / general purpose

Download

6120

100% Ag

Fine line, general purpose, inner multi layer trace

Download

6125

100% Ag

Thick printing for low resistivity applications

Download

6150

Etchable

High conductivity, 100% silver for etching fine lines

Download

6540

Plug

Very high solids paste for plugging holes in the substrate

Technical Advice 

enquiries@inseto.co.uk

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