Plansee
TMS (formerly Polese) produce Multi-Layer Co-Fired Ceramic
Packages, Single Chip and Multi Chip Substrates for low and
medium volume applications. Capabilities include Pins,
Seal-Frames & Packages as large as four inches square
and between 2 and 30 layers of circuitry
Plansee TMS's ceramic manufacturing process begins with exacting
material control and selection. These materials are then ball
milled under tight process controls prior to tape casting.
Over
the years, Plansee has developed proprietary formulations
resulting in consistent dimensional control to 1 percent and
flatness of .003” per inch after firing. In certain product
types, however, Plansee can achieve a flatness of .001” per
inch when necessary.
Using this green tape technology as a building block, Plansee
produces a variety of multilayer ceramic packages with solid
conductive vias for Z-axis connections, as well as post-fire
metallisation when needed, to meet today's challenges of increased
I/O termination, greater circuit density and higher thermal
management. With their present technology, 4 x 4 arrays
of multilayer structure can be produced on a routine basis.
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