Plansee - Thermal Management Materials & Multi-Layer Ceramic Packages etc.

Plansee TMS (formerly Polese) is a leading manufacturer of high thermal conductivity, controlled expansion metal matrix composites such as CuW - Copper Tungsten, CuMo - Copper Molybdenum (Copper Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper Laminate, Silvar, AlSiC Aluminium Silicon Carbide and of Seal Frames for Hermetic Packaging.

As the world leader in the manufacture of copper tungsten, copper molybdenum, and other metal matrix composites for thermal management applications i.e. high power semiconductor heatsinks etc., Plansee TMS utilises state-of-the-art powder metal technology. Plansee TMS maintains uncompromising dedication to continuous improvement in its engineered materials. Constantly-monitored criteria include composition, analysis of trace elements, particle distribution, grain size, tap density and flow characteristics.

Plansee's products include thermal management materials for wireless communication, internet infrastructure, military, aerospace and industrial applications.   Plansee TMS also offers multi-layer co-fired ceramics to enhance its leading position in the field of thermal management.  This unique combination of capabilities, along with its strong background in brazing and plating, has enabled Plansee TMS to produce unique products in such fields as Wireless Communication and Fiber-Optics.

Product Range Overview:

	Thermal Management Metal Matrix Materials, including CuW - Copper Tungsten, CuMo - Copper Molybdenum (Copper Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper Laminate, Silvar, AlSiC Aluminium Silicon Carbide.	Detailed Overview & Datasheet
	Multi-Layer Co-Fired Ceramic Packages, Single Chip and Multi Chip Substrates for low and medium volume applications.  Capabilities include Pins, Seal-Frames & Packages as large as four inches square and between 2 and 30 layers of circuitry.	Detailed Overview & Datasheet
Applications / Uses	Die Bonding Sub-Mounts Heat Dissipation / Heatsinks Thermal Interface Microwave Carriers LDMOS, Power and Bi-Polar RF Transistor Packages Laser Diode Substrates, Mounts and Blocks RF Transistor Flanges and Bases Seal Frames Hermetic Packages & Enclosures Hermetic Packages & Enclosures High Speed Digital Packages
Industry Segments:	Wireless Internet Infrastructure Military Aerospace Industrial Telecommunications Fiber Optics / Photonic Assembly Microwave Electronics Microelectronics Power Semiconductor Assembly Semiconductor Back-end Assembly etc.
Technical Advice	enquiries@inseto.co.uk
Plansee Website