| Plansee
- Thermal Management Materials & Multi-Layer Ceramic Packages
etc.
Plansee
TMS (formerly Polese) is a leading manufacturer of high thermal
conductivity, controlled expansion metal matrix composites
such as CuW - Copper Tungsten, CuMo - Copper Molybdenum (Copper
Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper Laminate, Silvar,
AlSiC Aluminium Silicon Carbide and of Seal Frames for Hermetic
Packaging.
As the world leader in the manufacture of copper tungsten,
copper molybdenum, and other metal matrix composites for thermal
management applications i.e. high power semiconductor heatsinks
etc., Plansee TMS utilises state-of-the-art powder metal technology.
Plansee TMS maintains uncompromising dedication to continuous
improvement in its engineered materials. Constantly-monitored
criteria include composition, analysis of trace elements,
particle distribution, grain size, tap density and flow characteristics.
Plansee's products include thermal management materials for
wireless communication, internet infrastructure, military,
aerospace and industrial applications. Plansee TMS
also offers multi-layer co-fired ceramics to enhance its leading
position in the field of thermal management. This unique
combination of capabilities, along with its strong background
in brazing and plating, has enabled Plansee TMS to produce
unique products in such fields as Wireless Communication and
Fiber-Optics.
Product
Range Overview: |
| |
Thermal Management Metal Matrix Materials, including CuW -
Copper Tungsten, CuMo - Copper Molybdenum (Copper Moly), Cu-MoCu-Cu
Copper-MolyCopper-Copper Laminate, Silvar, AlSiC Aluminium
Silicon Carbide. |
Detailed
Overview & Datasheet |
| |
Multi-Layer
Co-Fired Ceramic Packages, Single Chip and Multi Chip Substrates
for low and medium volume applications. Capabilities
include Pins, Seal-Frames & Packages as large as four
inches square and between 2 and 30 layers of circuitry. |
Detailed
Overview & Datasheet |
| Applications
/ Uses |
Die
Bonding Sub-Mounts
Heat Dissipation / Heatsinks
Thermal
Interface
Microwave
Carriers
LDMOS,
Power and Bi-Polar RF Transistor Packages
Laser
Diode Substrates, Mounts and Blocks
RF
Transistor Flanges and Bases
Seal
Frames
Hermetic
Packages & Enclosures
Hermetic
Packages & Enclosures
High
Speed Digital Packages
|
