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Material Properties (65Kb)
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Plansee
TMS (formerly Polese) produces Thermal Management Metal Matrix
Materials, including CuW - Copper Tungsten, CuMo - Copper
Molybdenum (Copper Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper
Laminate, Silvar, AlSiC Aluminium Silicon Carbide.
As
the world leader in the manufacture of copper tungsten, copper
molybdenum, and other metal matrix composites for thermal
management applications, Plansee TMS utilises state-of-the-art
powder metal technology. They maintain uncompromising dedication
to continuous improvement in their engineered materials. Constantly-monitored
criteria include composition, analysis of trace elements,
particle distribution, grain size, tap density and flow characteristics.
Once released for production these materials are pressed to
near net shape. Plansee TMS employs both mechanical and hydraulic
presses in wide load ranges from 10 tons to 250 tons. These
digital presses allow fully automated operations and precisely
maintain critical technological characteristics. This capability
allowed Plansee TMS to pioneer near net shape substrates out
of refractory metal powders. By controlling this operation
in-house, Plansee TMS has the ability to be a low cost provider
by strictly controlling its material usage, customising tooling
shapes and reducing or eliminating machining in its production
of composite substrates.
After pressing, the parts are ready for sintering. Plansee
TMS has one of the largest furnace capabilities worldwide
for sintering and infiltrating refractory composites. The
company employs over 20 state of the art continuous and batch
furnaces, which allow precision control of critical technological
characteristics: density, microstructure, thermal conductivity
& dimensional tolerance.
As a recognised leader in high precision plating for microelectronic
applications, Plansee TMS has three state-of-the-art plating
lines. One line is dedicated to electroless nickel and gold.
Plansee TMS has a high-volume automated plating capability
as well as extensive barrel plating for low cost solutions. |
| Applications
/ Uses |
Die
Bonding Sub-Mounts
Heat
Dissipation
Thermal
Interface
Microwave
Carriers
LDMOS,
Power and Bi-Polar RF Transistor Packages
Laser
Diode Substrates, Mounts and Blocks
RF
Transistor Flanges and Bases
Seal
Frames
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