SPM's aluminium or gold bonding wire & ribbon is widely
used in the manufacturing of microelectronic devices as the
electrical interconnect either between a chip and substrate
or between two chips. All materials used by SPM are of the
highest quality, refined and alloyed to produce the properties
demanded of finished wire and ribbon products.
SPM
makes several alloyed aluminium wires. These alloys are generally
preferred to pure aluminium wire (except in high-current devices)
because of greater drawing ease to fine sizes and higher pull-test
strengths in finished devices. Pure aluminium and 0.5% Mg
aluminium are the most commonly used in sizes larger than
0.004" (100microns). All-aluminium systems in semiconductor
device fabrication eliminate the "purple plague" (brittle
gold-aluminium intermetalic compound) sometimes associated
with pure gold bonding wire. Aluminium is particularly suitable
for ultrasonic bonding.
Heavy
/ large aluminium bonding wire for microelectronics is drawn
from one of three materials: 5/9's pure aluminium, 4/9's pure
aluminium, or 0.5% Mg aluminium alloy. The 5/9's, 4/9's
and 0.5% Mg aluminium each exhibit unique properties, which
can be used to overcome any unusual bonding conditions that
may be experienced.
Gold
wire standards are unsurpassed in the industry. SPM has perfected
the process of manufacturing wires in diameters as small as
0.0005" (12.5 microns) and wires where uniformity of elongation,
tensile strength and diameter are of paramount importance.
The gold wire is high-purity vacuum-processed from highly
refined metals. SPM has a long-standing reputation for providing
custom wire properties for specialised applications using
automatic wire bonders.
SPM
also manufactures ribbons of pure gold and base metals for
microwave and other applications. These ribbons are typically
custom-manufactured to exacting specifications. As with wire,
many of the base metals supplied as ribbon can be plated with
other metals for PC board repair and other applications.
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Aluminium
Wire & Ribbon Datasheet (40Kb)