SPM manufactures high quality preforms and washers including
gold based eutectic die attach solder preforms eg. gold tin,
gold germanium, gold silicon etc. & soldering preforms
/ solder washers, used to solder or connect electronic circuitry,
package electronic circuitry, dissipate heat, or provide an
interface for an electronic connection.
Solder preforms / solder washers manufactured by SPM are custom-shaped
stampings used to solder metal parts to a substrate (a base
on which the electronic circuitry rests). By definition, solder
preforms must quickly change from a solid state to a molten
state and back again during the bonding process.
SPM
utilises it's own in house tooling department to review, design
and build tooling to customer specifications. SPM also uses
progressive dies to create a variety of 3 dimensional configurations
and uses EDM built tools to provide extraordinary precision
and variety to the geometry's of their parts.
They
have a wealth of experience manufacturing parts with overall
tolerances +/- 0.005" to 0.0005" and thickness tolerances
+/- 0.0005" to 0.0001" Semiconductor Packaging Materials
has made parts as small as 0.004" with a tolerance of
+/- 0.0005". Precision stampings are a hallmark of Semiconductor
Packaging Materials.
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Solder
Preforms Datasheet (53Kb)