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SPM
- Bonding Wire & Ribbon, Precision Metal Stampings & Solder
Preforms
Semiconductor
Packaging Materials (SPM) are a diverse, world class manufacturer
of interconnect solutions for the microelectronics industry.
Their products are currently divided into several product groups:
bonding wire or ribbon in gold, silver, aluminium, copper etc.,
precision metal stampings in a wide range of metals, custom alloyed
strip and cladded materials including metal to metal clad, or solder
clad.
They
are a leading provider of quality fine gold wire, aluminium and
alloyed wire, which is sold to a diverse customer and application
base, including hybrid, medical and automotive manufacturers.
SPM's special proprietary wire alloys and doping recipes, combined
with its extensive wire manufacturing capabilities in the US, Morocco
and Malaysia, make SPM the preferred choice for their global customers.
SPM
manufactures high precision metal stampings and clad materials used
to solder or connect electronic circuitry, dissipate heat, or provide
an interface for an electronic connection. Many of SPM's
products are supplied in tape on reel or waffle pack for robotic
loading, and are packed in a Class 10,000 clean room,
SPM are qualified to ISO 9002, QS9000 and ISO14001 and serve the
following industries:
Product
Range Overview:
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Bonding Wire & Ribbon - SPM manufacture Gold Wire 99.99%,
Large Aluminium Wire to 99.999%, Fine Aluminium Wire with
1% Silicon, Aluminium Wire with 0.5% Manganese, and Silver,
Nickel and Copper bonding wires. |
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Detailed
Overview & Datasheet |
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Solder
Preforms - SPM manufactures an extensive range of solder preforms
and ribbon, specialising in Gold and Indium based alloys.
A wide range of tooling exists, allowing the customer to keep
costs to a minimum.
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Detailed
Overview & Datasheet
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Precision
Metal Stampings - SPM manufactures precision metal stampings
and clad metal or clad solder metal parts. Typical products
include Aluminium clad Copper bond pads, Copper / Invar /
Copper ribbon and preforms, and Gold / Germanium (88/12) clad
Kovar discs.
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Detailed
Overview & Datasheet |
Further
Information On SPM
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Applications
/ Uses |
Wire
Bonding
Die Bonding
Material
Interconnect
Heat Dissipation
Thermal
Interface
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Industry
Segments: |
Military
Aerospace
Automotive
Telecommunications
Medical
Electronics
Fiber
Optics /
Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly etc.
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| Technical
Advice |
enquiries@inseto.co.uk
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| SPM
Website |
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