Inseto
Ultrasonic Bonding Wedges, Collets, Pickup Tools & Precision Nozzles By Micro Point Pro Ltd
Micro Point Pro was formed by a management buy-out of the former K&S Wedge Bond business unit known as MicroSwiss. The Company is a leading manufacturer of advanced wire bonding tools, including ultrasonic wedge tools for small wire and ribbon bonding, single point TAB bonding tools, die attach collets and die bond tools, with customs tools also available on request. The Micro-Swiss product range was designed to suit all major brands of wire bonding, die bonding and TAB bonding equipment.
Product Range Overview:
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Ultrasonic Wedge Bonding Tools - Formerly K&S
MicroSwiss, Micro Point Pro manufactures a complete line of
standard and custom wedge tools to fit all applications, including
fine pitch bonding for all types of bonding platforms. Their
wedge tools are selected or specially designed to meet customers'
specifications for bond length, shape, surface finish, front
& back radius and other criteria affecting bond location,
strength and looping. |
Die Bonding
Tools & Collets - Formerly K&S MicroSwiss,
Micro Point Pro products also include die collets and pick up
tools, manufactured from various metallic (stainless steel,
tungsten carbide or titanium carbide) and non-metallic (PVC,
MSP, Vespel or Derlin) materials to suit almost any application
including eutectic bonding. |
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Further
Information On Micro Point Pro Consumables: |
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| Applications | Wedge
Wire Bonding, Ribbon Bonding, Die Bonding, Tab Bonding, Eutectic
Die Attach, Die Sorting |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices |
| Technical Advice | |
| Micro Point Pro Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
