Automatic Small Wire Bonder: Orthodyne 3700Plus

Orthodyne 3700Plus Fine Small Wire Aluminium Ultrasonic Bonder

The 3700Plus is a high-speed, high-accuracy wire bonder specifically designed for small wire wedge bonding of hybrid, COB, and MCM applications.

The 3700Plus represents a new wire bonder platform that meets today's advanced packaging challenges. Its technology delivers high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with the market demands.

The system features:

  • High speed, high quality wire bonding
  • Windows based graphical user interface for simple programming & use
  • High performance & reliability
  • Large bonding area with integrated safety curtain
  • Enhanced grey scale vision
  • Orthodyne 120KHz digital ultrasonic system
  • Onboard bond process monitoring & SPC reporting
  • Repeatable & programmable tail length control
  • Automatic loop control option
  • Manual to automatic bonding controls
  • Networking via Ethernet, USB, or Serial port
  • Standalone or inline configuration

Download Orthodyne 3700PlusOrthodyne 3700Plus Datasheet Datasheet 867kB
Further Information On Orthodyne Ultrasonic Small Wire Wedge Bonders:
Applications
Aluminium & Gold Wedge Wire Bonding Of: Microelectronic Devices, Chip-on-Board Assemblies, Power Hybrid Modules, Semiconductor Components, Multi-chip-Modules
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Technical Advice
Orthodyne Website
Orthodyne Homepage
Region
Available from Inseto in the United Kingdom, Ireland & Scandinavia

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