Inseto

Manual Large Wire Bonder: Orthodyne Model 20

A bench-mounted semi manual wire bonder for large diameter wire & ribbon bonding of power devices / components using gold or aluminium wires.

The Model 20 is ideal for small to medium size production and for use on universities or development laboratories.

The Model 20 can bond wire sizes from 100 to 625 microns in diameter, with ribbon bonding options:

The system features:

Automatic looping and step-back
Deep access, multiple stitch, and manual Z options
Phase-locked generator maintains power frequency and eliminates manual re-tuning
Transducer demand control produces perfect bonds regardless of minor bond site differences
Optional spotlight targeting
Can be operated in semiautomatic or manual mode
Simple, high yield use & reliability

Further Information On Orthodyne Manual Ultrasonic Large Wire, Benchtop Wire Bonders:
Applications	Aluminium & Gold Wedge Wire Bonding Of: Microelectronic Devices, Chip-on-Board Assemblies, Power Hybrid Modules, Semiconductor Components, Multi-chip-Modules
Industry Segments	Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Technical Advice	enquiries@inseto.co.uk
Orthodyne Website
Region	Available from Inseto in the United Kingdom, Ireland & Scandinavia

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