Inseto
Wedge Wire Bonding Equipment By Orthodyne Electronics
For more than 30 years, Orthodyne Electronics have been the worlds leader in design, innovation and manufacture of wire bonders for wedge bonding in the semiconductor, microelectronic, automotive and industrial markets.
Orthodyne wire bonders are known for their outstanding reliability and performance combined with the industries best level of after sales support.
The Orthodyne product family of wire bonding equipment includes semiautomatic bench-top wire bonders to fully automatic stand-alone or inline wire bonders, for ultrasonic bonding both small and large wire diameters from 17 to 625microns for power electronic devices.
Product range overview (click image below for more detailed information):
 |
Model
20 - Semi manual bench-top wire bonder for large
diameter wire & ribbon bonding of power devices / components
using gold or aluminium wires. |
 |
Model
3600Plus - Fully automatic advanced stand-alone
or inline wire bonder, for high speed bonding of small to large
area devices using large diameter wires (100 to 500 microns). |
 |
Model
3700Plus - Fully automatic advanced stand-alone
or inline fine wire bonder, for high speed bonding of small
to large area devices using small diameter wires (17 to 75 microns). |
 |
Model
3600R PowerRibbon® is a new
technology designed to work with existing packages that use
gold and aluminum wire bonds, as well as new package applications.
It requires little change in many of today's existing packages
and utilizes the same environmentally-friendly ultrasonic process
as aluminum wire bonding. PowerRibbon® combines the flexibility
and robustness of the large aluminum wire bonding process with
higher productivity, and provides electrical performance close
to Copper clip bonding. |
Further
Information On Orthodyne Wire Bonding Equipment: |
|
| Applications | Aluminium
& Gold Wedge Wire Bonding Of: Microelectronic Devices, Chip-on-Board
Assemblies, Power Hybrid Modules, Semiconductor Components,
Multi-chip-Modules |
| Industry Segments | Semiconductor,
Automotive, Aerospace, Military, Telecommunications, Medical
Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Medical
Devices, Battery |
| Technical Papers | Design Considerations for
Wire Bonding Power Hybrids (
332Kb)Heavy Al Ribbon Interconnect: An Alternative Solution for Hybrid Power Packaging (
555Kb) |
| Technical Advice | |
| Orthodyne Website |  |
| Region | Available
from Inseto in the United Kingdom & Ireland |
| homepage > products > microelectronic equipment > Orthodyne Wirebonders | |
