Lead Free Soldering Products

SENJU leads the field in the development and testing of lead free paste, wire, bar & flux soldering solutions. Having jointly patented its first lead free alloy in 1992, the Company has accumulated great wealth of data on the performance of a wide range of lead free solder alloys and has acquired the expertise to make the lead free soldering process work efficiently.

Senju offers the complete range of lead free solutions for reflow soldering, wave soldering and manual attachment and rework, in the forms of lead free solder paste, lead free alloys, lead free flux cored solder wire and solder spheres.

Standard Solder Pastes

Senju's Sparkle Paste OZ series removes the “im” from “impossible”. Formulated using a range of alloys and spherical oxide zero solder powders. With closely controlled particle distribution and highly stable flux technology, sparkle solder paste exhibit outstanding printing characteristics. With controlled Rheology this enables crisp, fine pitch deposits to be printed without slumping, either with squeegees or enclosed head systems.

The standard alloy range includes Anti-tombstoning products that prevent tombstoning using twin peak melting point technology. Senju Sparkle Paste OZ series of products are suitable for surface mount assembly and many other reflow soldering applications including component assembly, sealing, bumping, die bonding and induction soldering.

Solder Spheres

Sparkle Spheres are small solder balls used in the manufacture of BGAs, CSPs, and a variety of micro soldering applications. The solder balls are manufactured to extremely tight tolerances with exceptionally clean surfaces and are packed in inert gas to inhibit oxidation and preserve solderability.