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SMT-Wertheim
- Solder Reflow Ovens & Adhesive Curing Ovens
SMT
Formed in 1987 and with over 2,000 installations, are Europe's leading
manufacturer of solder reflow and curing systems. SMT produce a
wide range of forced convection reflow soldering and curing systems,
from entry level through high speed, very high volume systems for
industrial production lines.
SMT
have always been at the forefront of technical innovation, in fact
they were the first manufacturer to exclusively use forced air convection
for heat transmission in 1993. Today SMT ovens are the most energy
efficient, high performance reflow ovens on the market, using from
3 kW h to max 7 kW h in the basic versions.
The
SMT ovens reflow any solder paste at set temperatures much lower
than in any other oven in the market. This is achieved by an extremely
efficient heat transfer system that uses high capacity fans and
SMT's latest patented air distribution "Power Nozzle"
technology in the peak zone. This results in less temperature stress
for boards and components, a smaller delta T between small and large
components, lower power consumption, less wear of the oven and the
possibility of using lead-free solder paste at normal peak set temperatures.
Model
Range Overview:
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SMT
XXS Low To Medium Volume Oven Range
A
small footprint full convection, solder reflow and curing
oven for low volume production. The range is available
in two basic versions (Air or Nitrogen), both incorporating
touch screen control systems and technology found in SMT's
higher capacity series. Available with mesh belt or
chain transport options.
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Detailed
Overview & Datasheet |
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SMT
XS Medium Volume Oven Range
A
full forced convection reflow oven available in three basic
versions air, nitrogen and nitrogen prepared and with alternative
control systems of either a touch screen or PC. Available
with mesh belt, chain over mesh, or chain transport options. |
Detailed
Overview & Datasheet |
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SMT
Quattro Peak® M Medium / Higher Volume Oven Range
The
SMT Quattro Peak® M convection reflow oven is available
in three basic versions (Air, Nitrogen and Nitrogen prepared)
and with alternative control systems (touch screen or PC).
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Detailed
Overview & Datasheet |
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SMT
SMT Quattro Peak® L High Volume Oven Range
The
SMT SMT Quattro Peak® L Reflow Soldering Systems, are
designed for high throughput, with a heated process length
of 3.4M or 4.4M. These systems are available in three basic
versions (Air, Nitrogen and Nitrogen prepared). |
Detailed
Overview & Datasheet |
Larger
Overns For Higher Volume Applications Can Be Found On The
SMT-Wertheim Website.
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Further
Information On SMT-Wertheim |
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Applications
/ Uses |
Solder Reflow
Inline
or Batch Build Reflow
Lead
Free Soldering
High
Temperature Reflow
Adhesive
Curing & Drying
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Industry
Segments: |
PCB
Assembly
Surface
Mount Assembly (SMT)
Industrial
Curing Applications
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| Technical
Papers |
 SMT
- Leadfree Solder Paste Reflow Paper (205Kb)
Soldering
Problem Solver Chart (3,050Kb)
Solder
Reflow Technology (150Kb)
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| Technical
Advice |
enquiries@inseto.co.uk
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| SMT-Wertheim
Website |
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