Thermal Management Materials & Multi-Layer Ceramic Packages By Plansee

Plansee TMS (formerly Polese) is a leading manufacturer of high thermal conductivity, controlled expansion metal matrix composites such as CuW - Copper Tungsten, CuMo - Copper Molybdenum (Copper Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper Laminate, Silvar, AlSiC Aluminium Silicon Carbide and of Seal Frames for Hermetic Packaging.

As the world leader in the manufacture of copper tungsten, copper molybdenum, and other metal matrix composites for thermal management applications i.e. high power semiconductor heatsinks etc., Plansee TMS utilises state-of-the-art powder metal technology. Plansee TMS maintains uncompromising dedication to continuous improvement in its engineered materials. Constantly-monitored criteria include composition, analysis of trace elements, particle distribution, grain size, tap density and flow characteristics.

Plansee's products include thermal management materials for wireless communication, internet infrastructure, military, aerospace and industrial applications. Plansee TMS also offers multi-layer co-fired ceramics to enhance its leading position in the field of thermal management. This unique combination of capabilities, along with its strong background in brazing and plating, has enabled Plansee TMS to produce unique products in such fields as Wireless Communication and Fiber-Optics.

Product range overview:

	Thermal Management Metal Matrix Materials - including CuW - Copper Tungsten, CuMo - Copper Molybdenum (Copper Moly), Cu-MoCu-Cu Copper-MolyCopper-Copper Laminate, Silvar, AlSiC Aluminium Silicon Carbide. Detailed Overview & Datasheet
	Multi-Layer Co-Fired Ceramic Packages - Single Chip and Multi Chip Substrates for low and medium volume applications. Capabilities include Pins, Seal-Frames & Packages as large as four inches square and between 2 and 30 layers of circuitry.
Further Information On Plansee TMS:
Applications	Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages
Industry Segments	Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Technical Advice	enquiries@inseto.co.uk
Plansee TMS Website
Region	Available from Inseto in the United Kingdom, Ireland & Scandinavia
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