Inseto Product Divisions Overview

Adhesives Division
Inseto's Adhesive Division provides technically advanced adhesives for bonding, sealing & encapsulation throughout the UK & Ireland. Exclusively representing DELO Industrial Adhesives in the UK & Ireland and ACC Silicones in the UK, our adhesive division has the technical expertise to advise on all your project requirements. Our experienced specialists will help with product selection, lab testing, trials, qualifications and application methods.

Microelectronics Equipment Division
Inseto's Microelectronics Equipment Division provides manufacturing equipment for the Microelectronic, Photonic, Nanoelectronic, Solar Cell and Semiconductor industries including probing systmes, dicing and scribing machines, die and wire bonders, plasma cleaners, ovens & vacuum soldering systems, material testers for pull & shear testing, microscopes, automatic inspection systems for wafers and high power test systems etc.

Microelectronics Materials Division
Inseto's Microelectronics Materials Division provides assembly materials and machine consumable items for the semiconductor, photonic and hybrid assembly industries. Products include gold, aluminium, copper and silver bonding wires and bonding ribbons, precision metal stampings, solder preforms, hermetic glass & ceramic sealed packages, thick film materials (thick film inks), metalised thin film and precision machined ceramics, thermal dissipation materials, and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc.

Download Inseto's Product Presentation Datasheet - PDF 403kB