Adhesives Division

Inseto provide high technology adhesives from DELO, including conductive epoxies, UV cured adhesives, light curing epoxies & light cure acrylics, cyanoacrylates instant adhesives, polyurethane adhesives, anaerobic adhesives, one and two part structural and casting epoxies, silicone sealants and adhesives, plus dispensing systems and UV curing lamps.

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Microelectronics Equipment Division

Inseto's division that provides equipment used in the production of microelectronic devices from wafer inspection systems, through probe test, wafer mounters, die bonders, die sorting / pick and place systems, manual to automatic wire bonders, wire bond pull and shear testers, plasma cleaning and surface preparation equipment, microscopes, to digital and analogue mixed signal test equipment.

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Microelectronics Materials Division

Inseto's Microelectronics Materials Division provides assembly materials and machine consumable items for the semiconductor, photonic and hybrid assembly industries. Products include gold, aluminium, copper and silver bonding wires and bonding ribbons, precision metal stampings, solder preforms, hermetic glass sealed packages, thick film materials (thick film inks), metalised thin film and machined ceramics, thermal dissipation materials, and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc..

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Click on the following link to download Inseto's Product Datasheet Booklet(324Kb) for an overview of our product range.