Datasheet 53Kb

SPM manufactures high quality preforms and washers including gold based eutectic die attach solder preforms eg. gold tin, gold germanium, gold silicon etc. & soldering preforms / washers, used to connect electronic circuitry, package electronic circuitry, dissipate heat, or provide an interface for an electronic connection.

Solder preforms / solder washers manufactured by SPM are custom-shaped stampings used to solder metal parts to a substrate (a base on which the electronic circuitry rests). By definition, solder preforms must quickly change from a solid state to a molten state and back again during the bonding process.

SPM utilises its in house tooling department to review, design and build tooling to customer specifications. SPM also uses progressive dies to create a variety of 3 dimensional configurations and uses EDM-built tools to provide extraordinary precision and variety to the geometries of their parts.

They have a wealth of experience manufacturing parts with overall tolerances +/- 0.005" to 0.0005" and thickness tolerances +/- 0.0005" to +/- 0.0001". Semiconductor Packaging Materials has made parts as small as 0.004" with a tolerance of +/- 0.0005". Precision stampings are a hallmark of Semiconductor Packaging Materials.