Inseto

Gold, Aluminium & Copper Bonding Wire & Ribbon

SPM - Semiconductor Packaging Materials aluminium, copper or gold based bonding wires & ribbons are widely used in the manufacturing of microelectronic devices as the electrical interconnect either between a chip and substrate or between two chips. All materials used by SPM are of the highest quality, refined and alloyed to produce the properties demanded of finished wire and ribbon products.

Product range overview:

	Gold Bonding Wire - SPM manufactures Au bond wires for low to high volume requirements with standards that are unsurpassed in the industry. SPM has perfected the process of manufacturing wires in diameters as small as 0.0005" (12.5 microns) and wires where uniformity of elongation, tensile strength and diameter are of paramount importance. The gold wire is high-purity vacuum-processed from highly refined metals. SPM also has a long-standing reputation for providing custom wire properties for specialised applications using automatic wire bonders.	Datasheet 38Kb
	Al/Si Wire - In order to assure that uniform high quality bonds can be obtained are high production speeds, special controls are used in the manufacture of 1% silicon-aluminum wire. At Semiconductor Packaging Materials, special attention is given to the most important characteristic of high grade bonding: homogeneity. Microscopic checks of the alloy structure of the finished lots of 1% silicon-aluminum wire are routinely performed. Wire processing is also carried out under conditions that yield the ultimate in surface cleanliness and smooth finish and permits entirely snag-free de-reeling.	Datasheet 40Kb
	Large Diamter Aluminium Bonding Wire - Heavy / large aluminium bonding wire for microelectronics is drawn from one of three materials: 5/9's pure aluminium, 4/9's pure aluminium, or 0.5% Mg aluminium alloy. The 5/9's, 4/9's and 0.5% Mg aluminium each exhibit unique properties, which can be used to overcome any unusual bonding conditions that may be experienced.	Datasheet 40Kb
	Copper Bonding Wire - Today copper wire is one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications. The advantages of using copper are well documented and because of these advantageous characteristics it is being used for fine wire ball bonding up to 75microns & for wedge bonding up to 250microns. It has the ability to be used at smaller diameters, producing the same performance as gold without the high material cost. SPM uses special packaging in order to protect the wire and achieve a longer shelf life.	Datasheet 170Kb
	Ribbon Products - SPM produces ribbons of pure gold and base metals for microwave and other applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge. As with wire, many of the base metals supplied as ribbon can be plated with other metals for PC board repair and other applications.
Further Information On SPM Bonding Wires & Ribbons:
Applications	Ultrasonic Wire Bonding, Gold Ball Bonding, Thermosonic Gold Bonding, Ultrasonic Aluminium Wedge Bonding, Power Ribbon Bonds, Parallel Gap Welding & Spot Welding etc.
Industry Segments	Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fiber Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
Technical Advice	enquiries@inseto.co.uk
SPM Website
Region	Available from Inseto in the United Kingdom, Ireland & Scandinavia

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