Inseto
Bonding Wire & Ribbon, Precision Metal Stampings & Solder Preforms By SPM Coining
Semiconductor Packaging Materials (SPM), a Coining Company, are a diverse world class manufacturer of interconnect solutions for the microelectronics industry. Their products are currently divided into several product groups: bonding wire & ribbon in gold, silver, aluminium, copper etc.; precision stampings in a wide range of metals; clad to other metals or solder alloys; and preforms and ribbon in all solder compositions.
They are a leading provider of quality fine gold wire, aluminium and alloyed wire, which is sold to a diverse customer and application base, including hybrid, medical and automotive manufacturers. SPM's special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US, Morocco and Malaysia, make SPM the preferred choice for their global customers.
SPM manufactures high precision metal stampings and clad materials used to solder or connect electronic circuitry, dissipate heat, or provide an interface for an electronic connection. Many of SPM's products are supplied in tape on reel or waffle pack for robotic loading, and are packed in a Class 10,000 clean room,
SPM are qualified to ISO 9002, QS9000 and ISO14001 and serve the following industries:
- Military
- Aerospace
- Automotive
- Telecommunications
- Medical Electronics
- Fiber Optics
- Microelectronics
- Semiconductor Back-end Assembly etc.
Product Range Overview (click image below for more detailed information):
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Bonding
Wire & Ribbon - Gold Wire 99.99%,
Large Aluminium Wire to 99.999%, Fine Aluminium Wire with 1%
Silicon, Aluminium Wire with 0.5% Manganese, and Silver, Nickel
and Copper bonding wires & ribbons. |
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Solder
Preforms - An extensive range
of solder preforms and ribbon, specialising in Gold and Indium
based alloys. A wide range of tooling exists, allowing the customer
to keep costs to a minimum. |
 |
Precision
Metal Stampings - Precision metal
stampings and clad metal or clad solder metal parts. Typical
products include Aluminium clad Copper bond pads, Copper / Invar
/ Copper ribbon and preforms, and Gold / Germanium (88/12) clad
Kovar discs. |
 |
Package
Cover Assemblies - Cover
Assemblies used to hermetically seal electronic packages. The
lids have pre-attached solder preform and are electroplated
for solderability and to prevent corrosion. |
Further
Information On SPM Coining Consumables: |
|
| Applications | Wire
Bonding, Ribbon Bonding, Die Bonding, Material Interconnect,
Heat Dissipation, Thermal Interface, Package Construction &
Sealing, Attaching, Soldering etc. |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Advice | |
| SPM Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
