Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thickfilm pastes for a wide variety of Microelectronic Hybrid applications.
Their Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.
The range of Silver-bearing pastes includes conductor materials, termination metalisations, plateable inks, low-temperature firing from 400°C, and also lead & cadmium free products.
Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.
Product Range Overview:
| Gold Thick Film Conductor Product Range | |||
| Part # | Type | Description | PDF |
| 4100 | Au Bondable | Gold wire bondable paste for multilayering & general use | Datasheet |
4101 |
Au Via Fill | Gold via fill conductor for small & large via holes | |
| 4129 | Au & Al bondable | Cd & Pb Free for fine line printing | Datasheet |
| 4150QJ | Au bondable | High electrical conductivity, fine line printing | Datasheet |
4225 |
Al Bondable | Aluminium wire bondable gold, compatible with 5807 dielectric | |
| 4496 | Solderable | Top layer solderable gold with good aged adhesion | |
| 4505 | Au bondable | 500°C firing, for glass circuits & resistor CCT repair | Datasheet |
| 4530 | Pull-thru | High binders for pull-thru & edge painting, low ESR | Datasheet |
| 4540 | Plug | Very high solids paste for plugging holes in the substrate | |
| 4550 | Etchable | Etchable gold with excellent fired density, wire bondable | |
| 4583 | Speciality | Ultra thin-print, laser trimable, firing up to 1050°C | Datasheet |
| 4586 | Speciality | Thin-printing, economical solderable gold | Datasheet |
| Silver Thick Film Conductor Product Range | |||
| Part # | Type | Description | PDF |
| 6101 | Ag Via Fill | Low shrinkage paste for filling dielectric vias | Datasheet |
| 6107 | Silver Conductor | For Terminations on Chip & Netword Resistors | Datasheet |
| 6160 | Silver Conductor | For terminations on chip and networked resistors | Datasheet |
| 6165 | High conductivity | 400°C or 500°C firing, high electrical conductivity | Datasheet |
| 6166 | High conductivity | High conductivity - 600°C firing, for resistor terminations | Datasheet |
| 6111 | 100% Ag | High speed printing / general purpose | Datasheet |
| 6120 | 100% Ag | Fine line, general purpose, inner multi layer trace |
Datasheet |
| 6125 | 100% Ag | Thick printing for low resistivity applications | Datasheet |
| 6150 | Etchable | High conductivity, 100% silver for etching fine lines | Datasheet |
| 6550-1 | Etchable | For very thin metalisation applications, multi-layer | Datasheet |
| Silver Palladium & Platinum Thick Film Conductor Product Range | |||
| Part # | Type | Description | PDF |
| 6225 | High Pd Content | Excellent leach & silver migration resistance | Datasheet |
| 6229 | Low Cost | Solderable terminations, low resistivity conductor | Datasheet |
| 6231 | High Pd Content | Excellent leach resistance | Datasheet |
| 6241 | Medium Pd Content | Excellent solder & leach resistance acceptance | Datasheet |
| 6250 | Two Options | Low & high viscosity for hole & castellation coating | Datasheet |
| 6261 | Mid-Price | Excellent solder adhesion, for industrial & automotive applications | Datasheet |
| 6291 | High Performance | Excellent solder acceptance & leach resistance | Datasheet |
| 6305 | AgPt | Excellent solder acceptance and leach resistance | Datasheet |
| 6333 | AgPt | Low Cost Excellent solder acceptance and leach resistance | Datasheet |
| 6410 | AgPtPd | Economical conductor with excellent leach resistance | Datasheet |
| 6493 | AgPtPd | For very demanding solder leach resistance requirements | Datasheet |
| 6540 | Plug | Very high solids paste for plugging holes in the substrate | Datasheet |
Further
Information On Koartan Thickfilm Conductor Pastes: |
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| Applications | Microelectronic
Devices, Microwave Devices, Heating Elements, Printable Resistors
& Thermistors |
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| Industry Segments | Microelectronic
/ Hybrid Assembly, Fiber Optics / Photonic Assembly, Microwave
Electronics, Automotive Electronics, Wireless Telecommunications,
Data Processing, Instrumentation, Military, Consumer Electronics,
Industrial Electronics |
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| Technical Advice | |||
| Koartan Website | |||
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia
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