Inseto
Vacuum Solder Reflow, RTA and Brazing Ovens
ATV's solder reflow ovens (SRO) with rapid thermal annealing (RTA) and brazing capability are IR lamp heated multi-purpose "cold wall" process ovens. The SRO is ideal for R&D, process development as well for low to high volume production with models including benchtop through stand-alone to fully automated high volume systems.
Applications include void-free solder die attach for power semiconductor and module assembly, hermetic package lid sealing, high vacuum encapsulation, high temperature soldering, Getter activation, diffusion and compression bonding etc.
System features comprise (model specific):
- Temperature: up to 1100°C
- Heated plates, up to 450 x 450 mm
- Fast heated plate ramping up > 3.5°C/second
- Fast heated plate ramping down > 2°C/second
- Flexible profile software: 100 steps per program
- Controlled atmosphere: Oxygen < 0,1 ppm, Hydrogen up to 100%
- 40 kHz/2,45 GHz plasma Option
- Formic acid activated nitrogen
- Ultimate Vacuum: ~ 7 x 10-7mbar
- High pressure atmosphere: up to 3 bar (abs)
- Flux less, with flux and solder paste
- Automation: cassette to cassette or in-line
Product range overview:
| SRO-700 | SRO-704/6/8/10/12 | ||
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| Tabletop System 450 Deg C (option to 750) 230 x 217 mm Heated Area Ramping up > 3.5°C/sec Ramping down > 2°C/sec Formic Acid Included
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Free Standing Systems 750 Deg C (option to 950) To 450x450mm Heated Area Ramping up > 3.5°C/sec Ramping down > 2°C/sec Formic Acid Option Plasma Option Getter Option Hydrogen or Forming Gas |
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Further
Information On ATV Vacuum Solder Reflow Ovens: |
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 Datasheets (PDF) |
ATV SRO Tabletop Model Datasheet 1.95MBB ATV SRO Free Standing Range Datasheet 2.1MB |
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| Applications | Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells |
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| Industry Segments | Power Device Production, Universtities,
Research Development, Production,
Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc. |
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| Technical Advice | |||
| ATV Website |  |
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| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
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