The DAGE-SERIES-4000 is the industries leading Multi-Function Bondtester with over 5000 systems installed worldwide. The modular system is capable of meeting all pull and shear testing applications including:

Wire Pull Test & Vector Pull Testing Tweezer Pull Test Cold-Bump Pull Solder Ball Pull & Shear Test Ball Bond Shear Testing Wedge Bond Shear Test Large Wire & Ribbon Shear Lead Free Zone Shear & Component Shear Die Shear & Stud Pull Zone Shear Testing Wafer Level testing etc.

The Series 4000 has been specifically designed to be ergonomically adjustable for operators; particular attention has been given to working heights, optics eyeline, arm rests and the position of controls, with a range of software settings including operator specific preferences, allowing the user to specifiy their preferred, ergonomic configuration.

The system features "Quick Release Intelligent Load Cartridges" with smart electronics to store and identify serial numbers and calibration details, enabling changeover between applications in less than 30 seconds.

A comprehensive range of work surfaces and workholders are also available, including a shuffle base (for dedicated low cost pull requirements), motorized X - Y stages, heated workholders, up to 300mm wafer chucks. Each work surface can be fitted with one of a number of universal or dedicated (application specific) workholders to accommodate leadframes, packages, substrates and wafers etc.

Dage Series 4000 Multi-function bond tester overview:

	The DAGE 4000 bondtester uses patented frictionless load cartridges and air bearing technologies which ensure maximum accuracy, repeatability and reproducibility. Cartridges for different applications are readily exchanged in less than 30 seconds. Many functions are automated and there are sophisticated electronic and software controls. Key Features * Wire Pull * Tweezer Pull/Peel * Ball Shear, Solder Ball Shear and Die Shear dependent on the system configuration. Each of the eight standard test heads incorporate four default software selectable operating ranges * Additional options include Cold Bump Pull, Vectored Pull for micro BGA, and automatic testing for small geometry packages * Internal SPC software to provide basic analysis * Fully ODBC compatible to exchange data with external Statistical Process Control systems. * System control is provided through an external PC running Windows
Download Series 4000 Datasheet 430kB
Further Information On Dage Wire Pull & Shear Testers:
Applications	Semiconductor Defect Analysis & Charracterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Ribbon Peel, Ribbon Pull, Stud Pull, Tweezer Pull, Vector Pull, Wedge Shear, Wire Pull & Zone Shear.
Industry Segments	Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Technical Advice	enquiries@inseto.co.uk
Nordons-DAGE Website
Region	Available from Inseto in the United Kingdom, Ireland & Scandinavia
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