Inseto’s Adhesive Division provides technically advanced adhesives and equipment for bonding, sealing & encapsulation, including UV cured acrylates, light activated epoxies, dual heat and light or moisture cured materials, anaerobic curing adhesives, single part silicones, cyanoacrylates, structural polyurethanes and one or two part epoxies.

Inseto’s Equipment Division is a leading supplier of assembly, test & inspection equipment including semiconductor furnaces, lithography equipment, probing systems, wafer dicers and scribers, die attach and wire bonding machines, plasma etching and cleaning systems, vacuum solder reflow ovens, wire bond and materials testing equipment in the UK, Ireland and Nordic regions.

Inseto’s Consumable Division provides production materials and tools used in the manufacturing of microelectronic and related devices, including wafers, bonding & welding wires-ribbons, stampings, solder preforms, hermetic packages, thin film substrates, thick film & thermal dissipation materials, welding electrodes and thermodes, bonding tools, capillaries and dicing blades etc.