Inseto
Inseto

Month: February 2021

Tresky AG Celebrates 40 Years

2nd February 2021

For the past 40 years, Switzerland based Tresky AG has been perfecting the art of developing and manufacturing manual and semiautomatic die attach equipment used for the research, fabrication and assembly of microelectronic devices.

With almost 2000 devices installed across the world, often with special & customized capabilities, Tresky’s equipment fulfils many complex die attach requirements, such as flip chip, low to high force bonding, plus sinter and eutectic solder processes. Model dependent, other applications supported include laser bar handling, stacking/un-stacking and die sorting.

As part of their 40 year anniversary celebrations, Tresky has introduced an updated version of their entry level T-4909-AE (Anniversary Edition), which features a new Raspberry Pi PC and touch screen interface for programming and control, plus an extended Z travel of 95mm, increasing clearance for bonding stacked devices, or into deep cavities etc.

Tresky equipment is supplied and supported by Inseto throughout the UK, Ireland and Nordic regions.

Click HERE to view the Tresky range of manual and semiautomatic die attach and component handling equipment.

Manual Flip Chip Die Bonder - Tresky T-4909-AE Flip Chip
New Tresky T-4909-AE (Anniversary Edition) Manual Die Bonder with Flip Chip Alignment