Andover, United Kingdom – Inseto is the first distributor serving the UK and Ireland to supply chip encapsulation adhesives for high reliability applications that are free of substances of very high concern (SVHC). Easy and trustworthy access to SVHC-free adhesives made in the EU will become essential if, or more likely when, industry regulations come into force banning the manufacture of such products.
As DELO’s exclusive distributor in the UK & Ireland, Inseto can supply DELO MONOPOX GE6585 and GE6525, which are primarily used for Dam & Fill chip encapsulation, and DELO DUALBOND GE7065, which is mainly used for Glob Top chip encapsulation. All three cure to from rigid protective coatings and can be used for encapsulating not only semiconductor die but also sensors, which is a common practice in the automotive, aerospace and harsh environment industrial sectors, for example.
“Whilst not all chip encapsulation adhesives contain SVHCs, those that are needed to ensure high reliability do,” comments Eamonn Redmond, Sales Manager of Inseto. “And the European Chemical Association is constantly reviewing and working towards banning the use of SVHCs. Whilst it’s not certain when adhesives containing SVHCs will be banned they almost certainly will be. In addition, these new adhesives offer significant processing and performance upgrades over their SVHC-containing counterparts.”
DELO MONOPOX GE6585, DELO MONOPOX GE6525 and DELO DUALBOND GE7065 are believed to be the first SVHC-free adhesives on the market for applications where high reliability is a necessity. They are offered as alternatives to existing DELO adhesives currently used for Dam & Fill and Glob Top chip encapsulation in applications where high reliability is important.
All three new adhesives have high shear strengths, low coefficients of thermal expansion (CTE), high glass transition temperatures (Tg), extended operating temperature ranges and an extremely high resistance to chemicals.
GE6585 and GE6525 are one-part heat-cured black epoxies. Compared to their SHVC-containing counterparts, the CTE has been nearly halved. However, the new adhesives retain the extremely high Tg of the existing adhesives (>170oC), making them ideal for high reliability applications; ensuring minimal risk of board warpage during assembly.
GE7065 is also a one-part heat-cured black epoxy with a low CTE and high Tg. It also has the added advantage of being light-fixable (optional) immediately after dispensing. In addition, the filler particle size is significantly reduced (to around 7μm), allowing the adhesive to flow more easily between very fine-pitch wire bonds.
All three new adhesives boast significantly shorter curing times than their SVHC-containing counterparts – 30 minutes at 100oC for GE6585 and GE6525, and 60 minutes at 130oC for GE7065 – and can be ordered now through Inseto.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied Custom Interconnect Limited (CIL) with a Kulicke & Soffa Asterion large diameter wire / ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power modules and the assembly of battery packs.
The Asterion is to play a crucial role in two major electric vehicle (EV) projects in which CIL is extensively involved. In the first, CIL is engaged with BMW on APC15@FutureBEV to maximise potential for future BEV systems. The project is one of 10 projects by the Advanced Propulsion Centre (APC) in its latest round of Government and industry funding for low-carbon emissions research.
In the second case, CIL is the project lead on GaNSiC – a project that stems from the UK Research and Innovation’s (UKRI) ‘Driving the Electric Revolution’ challenge and brings together CIL and Compound Semiconductor Applications Catapult (CSA Catapult). It is set to develop novel ways of applying Silver Sinter pastes to WBG semiconductors, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, to optimise their thermal coupling and solve complex power module assembly challenges.
John Boston, Managing Director of CIL, comments: “Because of the high currents EV power modules handle, both projects require the placement of heavy gauge wire or ribbon, of between 150 and 600microns diameter or width compared to fine-wire bonding, which tends to be about 25microns.”
Boston goes on to say that SiC-based power module designs are aiming to switch up to 800VDC and handle up to 600A. He adds: “You need heavy gauge, but heavy gauge wire bonding of wide bandgap materials is a relatively new technology. More than ever before, there’s a need for collaboration and trust within the industry. Also, with keeping costs low such an imperative in the automotive sector, the use of advanced manufacturing tools likely to produce the best results is essential, particularly when some vehicle manufacturers are demanding zero defects and stipulating that reworks are not allowed.
CIL is an electronic solutions provider. It has the largest independent ‘chip and wire’ facility in the UK and its micro-electronics packaging facility is regarded as being at the forefront of the EV power revolution.
Boston concludes: “In addition to APC15@FutureBEV and GaNSiC, we’re the manufacturing partner on many other EV projects, plus we have many customers in the aerospace sector – active under initiatives like the More Electric Aircraft and the All-Electric Aircraft. “
The K&S Asterion is located in CIL’s BEV facility, and joins an automatic die bonder and high pressure Silver Sinter press (both of which are for the packaging of WBG materials) and a scanning acoustic microscope, used to detect voids. The Asterion will also be used in the manufacture of EV batteries, specifically for bonding between cells and busbars/plates.
Established in 1986 and ISO9001:2015, ISO13485:2016 (Medical) and AS9100D (Aerospace) certification, CIL is also on the path to ISO/TS 16949:2009 (Automotive) certification. CIL has transitioned from a conventional EMS company into an Electronic Solutions Provider and currently manufactures some of the most complex mission critical electronic assemblies in the UK. A combination of 6 SMT lines, 3D AOI, Flying probe test and laser depanelling enables it to manufacture complex SMT PCBA. In addition, CIL also has one of the largest independent die and wirebond facilities in the UK. Three Automatic die bonders, and six Automatic wire bonders and various encapsulation systems are available. It is now entering a WBG power module manufacturing era to support both UK and EU based companies deploy SiC and GaN based assemblies.