Inseto
Inseto

Month: August 2021

Sintering SiC Die Attach for High Power Electronic Devices

3rd August 2021

Example: Sintering SiC Die Attach of Semiconductor Devices

Check out the our latest “Knowledge Base” article on sintering SiC die first produced for e-mobility technology magazine (Summer Issue #9) and reproduced with kind permission of the editor on our website.

Silicon carbide (SiC) is the semiconductor material of choice for high power semiconductor transistors. They can switch far higher voltages and currents than devices fabricated from silicon. They can also run much hotter, presenting packaging challenges.

A popular substrate on to which SiC die is attached is copper. It is a good conductor of power and heat. However, the thermal conductivity of a typical die attach solder is not great, and melting points max out at circa 220°C.

An alternative to soldering is sintering. A paste comprising monometallic particles and a resin is printed onto a substrate in patterns corresponding to the shapes and locations of the SiC dies. The substrate is heated to evaporate the resin and the dies are placed. The sintering process itself sees a combination of heat and pressure.

Inseto is exclusive distributor for AMX’s range of equipment for sintering of die and leadframe assemblies, plus automatic inline acoustic microscopy. in the UK, Ireland and Nordic regions.