DELO manufacture a range of adhesives with low ionic levels for electronic applications, including
glob top materials for encapsulating devices or assemblies, dam / fill materials, silicones, plus light activated and light cured products for encapsulation, sealing and joining, applications include:
MicroElectroMechanical Systems (MEMS) are found in a very wide variety of applications, from smart phones to military gyroscopes. These are usually measuring minute relative changes in the surrounding environment, so the adhesive used to bond the MEMS device to the substrate must be highly stress-relieving, in order that the adhesive itself doesn’t induce stress into the MEMS device. DELO has developed a range of highly flexible adhesives that also offers high bond strength, a very unusual combination that has in the past proved very difficult to master!
Odd-Form Component Fixing
Some demanding applications require tall, odd-form components to be bonded to the PCB after solder reflow, in order to provide additional mechanical strength. This is achieved by DELO-KATIOBOND light-cured adhesives, dispensed around the relevant components and cured very quickly by a high-intensity light source. The high speed of the curing process means that additional manufacturing time is limited, thereby keeping costs under control.
LED Lens Bonding
DELO has developed a range of optically-clear adhesives that offer very low outgassing, which is critical for the working life of the lens. These adhesives also exhibit high thermal resistance and excellent UV stability, and have very low shrinkage. They are suitable for bonding the lens cap in place, and have excellent adhesion to glass, ceramic, and aluminium.
Relay Pin Sealing
Relays are enclosed in plastic to provide resistance to outside influences such as dirt & dust, extreme temperature variations, reflow soldering. The relays, usually made from plastic, need to be sealed for these reasons, and because they are usually manufactured in large volumes, a fast-curing adhesive is required. DELO-KATIOBOND is the material-of-choice as it meets all these requirements, as well as providing excellent adhesion.
The success of the smart phone and tablet markets has triggered a boom in touch panel displays - the glass panel is bonded to the housing, and this can cause undesired reflections and limited visibility in direct sunlight. DELO’s new family of optically-clear adhesives eliminates these problems, as well as being used extensively in industrial, ruggedized displays. These adhesives are highly transparent with no yellowing in sunlight, they have enhanced shock and vibration resistance, and they prevent condensation and fogging.
Silicon Wafer Manufacturing
Cutting individual wafers from silicon ingots is a delicate operation, as the ingot needs to be held in such a way that the silicon is not damaged. This is achieved by using a removable DELO-DUOPOX two-part epoxy to bond the ingot onto the glass substrate. After the adhesive is cured, the ingot is cut into the individual wafers by an EDM process. The adhesive is then removed by immersing the assembly into a 15% formic acid solution, at 80C, for three minutes. This ensures optimal yields for the wafers.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland