Protecting bare silicon die is done in a variety of ways, by overmoulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates.
Depending on the die size, either a single-stage globtop is used or, for larger die, a two-stage process of damming the die with a high-viscosity adhesive and filling the enclosed space with a low-viscosity compatible adhesive.
DELO's family of anhydride-curing epoxies offer significant advantages to the user:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Bonding, Glob-Top, Encapsulation, Sealing, Potting, Protection against Vibration, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland