Encapsulation / Glob Top Adhesives

ENCAPSULATION / GLOB TOP ADHESIVES

Protecting bare silicon die is done in a variety of ways, by overmoulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates.

Depending on the die size, either a single-stage globtop is used or, for larger die, a two-stage process of damming the die with a high-viscosity adhesive and filling the enclosed space with a low-viscosity compatible adhesive.

DELO's family of anhydride-curing epoxies offer significant advantages to the user:

  • Dam heights of 3mm and above
  • Simultaneous curing of dam and fill
  • Fast curing times of 20 minutes at 150C
  • Optional low-temperature cure temperature at 100C
  • Operating temperature range from -65C to +180C
  • Low CTE's of < 25ppm for thermal mis-match compensation
  • High Tg's of approx. 178C, with decomposition temperatures in excess of 320C
  • Excellent chemical and media resistance
  • Compliance with JEDEC MSL 1 requirements
  • Thermal shock resistance of > 1,000 cycles from -40C to +150C
  • High purity with < 10ppm ionic impurities
  • Low humidity sensitivity due to < 0.1% water absorption

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Bonding, Glob-Top, Encapsulation, Sealing, Potting, Protection against Vibration, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

DELO Website

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Available from Inseto in the United Kingdom & Ireland

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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