Inseto
Inseto

Knowledge Base Fact Sheet

Adhesives for Die Attach (IKB071)

This is a guide to the different types of adhesives for die attach available from Inseto. Both traditional die attach adhesives (wire-bonded) and flip-chip (Z-axis) adhesives are previewed, with a brief overview of each adhesive. Comparison charts are also provided to help choose the most appropriate solution.

Inseto supplies a range of non-conductive epoxies for various die attach applications found in microelectronic and related semiconductor applications. Non-conductive epoxies are used where the device requires no electrical transmission through the back of the die. Electrically conductive materials, also known as isotropic adhesives, are used where the device requires an electrical transmission through the back of the die. Thermally conductive die attach adhesives transmit heat but are electrically insulating.

The choice of adhesive type is usually dictated by the way the die has been designed, especially regarding electrical conductivity. However, for cost reasons, electrically conductive adhesives are only chosen where absolutely necessary, as they are significantly more expensive that non-conductive adhesives. A need for thermal conductivity often doesn’t become apparent until the first prototype parts are assembled and tested.

Note: All adhesives are 1-part, solvent-free.

Non Conductive and Conductive Die Attach Adhesive “Comparison Chart”:

Conductive and Non-Conductive Die Attach Adhesive "Comparison Chart"

TermDefinition
Non-Conductive Die Attach Adhesives Overview:
DELO DUALBOND AD340An unfilled epoxy suitable for temperature-sensitive substrates (curing at 80°C in 30 minutes). Can be light-fixed in seconds for high-placement accuracy.
DELO DUALBOND AD761A fast-curing epoxy (3 minutes at 150°C) with excellent compliance for larger die applications. Can be light-fixed in seconds for high-placement accuracy. Very long pot life of 7 days.
DELO DUALBOND BS3770A B-Staged epoxy also suitable for lid attach. A-stage cured in 10 seconds using UV light, then B-Staged in the oven for 40 minutes at 150°C. Suitable for a flexible manufacturing process.
DELO MONOPOX DA255An unfilled epoxy ideal for fast-curing applications: 2 minutes at 150°C (or thermode cure in 6 seconds at 180°C). Very high die shear strength of 210 Newtons.
DELO MONOPOX DA587An unfilled epoxy ideal for fast-curing applications: 2 minutes at 150C. Longer than usual pot life of 5 days.
DELO MONOPOX DA588An unfilled epoxy ideal for fast-curing applications: 2 minutes at 150C. Ideal for Smart Card applications.
DELO DUALBOND LT354An unfilled epoxy suitable for temperature-sensitive substrates (curing at 80°C in 30 minutes). Can be light-fixed in seconds for high-placement accuracy.
DELO DUALBOND OB749An unfilled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (2 - 6 seconds at 60 mW/cm2) mechanisms. Complies with ESA (ECSS-Q-70 02) and NASA (ASTM E 595-93) outgassing requirements.
DELO DUALBOND OB786An unfilled epoxy with independent heat-curing (50 minutes at 80°C) and light-curing (4 seconds at 150 mW/cm2) mechanisms. Very high Tg of 179°C.
DELO DUALBOND OB787A high viscosity unfilled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (2 - 6 seconds at 60 mW/cm2) mechanisms. Very high Tg of 185°C.
DELO DUALBOND OB793A high viscosity unfilled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (5 - 10 seconds at 60 mW/cm2) mechanisms.
Conductive Die Attach Adhesives Overview:
DELO DUALBOND IC343A silver-filled epoxy that has an optional UV-curing capability; a 1 - 5 second UV tack-in-place followed by 30 minutes at 80°C; ideal for high-accuracy placement requirements; extremely low outgassing, meeting international HDD (Hard Disk Drive) requirements (>> ESA / NASA).
Thermally Conductive, Electrically Insulating Die Attach Adhesives Overview:
DELO MONOPOX TC2270Filled with aluminium nitride for enhanced thermal conductivity (1.7W / m*K). Very low temperature curing (90 minutes at 60°C). Meets JEDEC MSL1 requirements.

Anisotropic Conductive Die Attach Adhesive “Comparison Chart”:

Anisotropic Die Attach Adhesive "Comparison Chart"

All anisotropic (Z-axis) adhesives require both heat and pressure (usually from a thermode or on the die bonder, with the collet holding the die in place) in order to achieve electrical conductivity in the Z-axis. A typical pressure is 1 – 2 Newtons / mm2, based on a 1mm-square die.

TermDefinition
Anisotropic Conductive Adhesives Overview:
DELO MONOPOX AC265Filled with gold-over-nickel plated polymer particles, typical size of 2.5µm. Cures in 6 seconds at 200°C. Extended pot life of 2 weeks.
DELO MONOPOX AC268Filled with nickel particles, typical size of 5µm. Cures in 6 seconds at 190°C.
DELO MONOPOX AC6530Filled with nickel particles, typical size of 5µm. Cures in 1 second at 230°C.
DELO MONOPOX AC6545Filled with nickel particles, typical size of 5µm. Cures in 1 second at 230°C.

For more information on our range of Die Attach Adhesives, please click HERE.

A general overview of the various die attach processes can be found HERE.

Author

Date

Version

Author

Eamonn Redmond

Date

15 June 2020

Version

IKB071 Rev. 1

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