Knowledge Base Fact Sheet
Adhesives for Die Attach (IKB071)
This is a guide to the different types of adhesives for die attach available from Inseto. Both traditional die attach adhesives (wire-bonded) and flip-chip (Z-axis) adhesives are previewed, with a brief overview of each adhesive. Comparison charts are also provided to help choose the most appropriate solution.
Inseto supplies a range of non-conductive epoxies for various die attach applications found in microelectronic and related semiconductor applications. Non-conductive epoxies are used where the device requires no electrical transmission through the back of the die. Electrically conductive materials, also known as isotropic adhesives, are used where the device requires an electrical transmission through the back of the die. Thermally conductive die attach adhesives transmit heat but are electrically insulating.
The choice of adhesive type is usually dictated by the way the die has been designed, especially regarding electrical conductivity. However, for cost reasons, electrically conductive adhesives are only chosen where absolutely necessary, as they are significantly more expensive that non-conductive adhesives. A need for thermal conductivity often doesn’t become apparent until the first prototype parts are assembled and tested.
Note: All adhesives are 1-part, solvent-free.
Non Conductive and Conductive Die Attach Adhesive “Comparison Chart”:
Anisotropic Conductive Die Attach Adhesive “Comparison Chart”:
All anisotropic (Z-axis) adhesives require both heat and pressure (usually from a thermode or on the die bonder, with the collet holding the die in place) in order to achieve electrical conductivity in the Z-axis. A typical pressure is 1 – 2 Newtons / mm2, based on a 1mm-square die.
For more information on our range of Die Attach Adhesives, please click HERE.
A general overview of the various die attach processes can be found HERE.
Author
Date
Version
Author
Eamonn Redmond
Date
15 June 2020
Version
IKB071 Rev. 1
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