DELO adhesives are used in a vast range of microelectronic applications including glob-top materials to encapsulate devices, dam / fill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining.
Detailed below are some examples, however if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has been solved before.
Reliability is paramount in microelectronic applications, whether the adhesive is used in military or commercial products. DELO’s high-purity, low CTE adhesives provide the perfect combination for use in all applications.
Protecting bare silicon die is done in a variety of ways, by overmoulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection against Vibration, Conductive Electrical Connection, Under-fill, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland