DELO – Reference Applications
DELO’s adhesives are used for joining, bonding, sealing, encapsulating, potting, gasketing, moulding, etc., throughout a wide range of industries.
Examples of just some of these applications are detailed below:
Microelectronic Applications
A range of high purity materials for assembly processes, including die attach and encapsulation.
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Electronic Applications
Adhesives with low ionic levels for applications in the electronic industry.
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Automotive Adhesive Applications
Highly media-resistant adhesives for the automotive sector.
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Adhesives for Plastic Applications
Adhesives that provide high-strength bonding and sealing for plastic device processing.
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Adhesives for Glass Applications
Fast-curing optically-clear adhesives that provide high-strength bonding.
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Adhesives for Mechanical Engineering Applications
Simple and easy processing, durable strength, weight and energy saving.
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Further Information
Applications
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Under-fill, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill, Securing, High Strength Mechanical Joining (Can Replace Soldering or Rivets), Casting, Potting, Gap Filling etc.
Industry Segments
Electronics, Microelectronics, Semiconductor, Automotive, Energy, Aerospace, Medical, Engineering, Plastics, Glass, Consumer Devices etc.
DELO Website
Region
Available from Inseto in the United Kingdom & Ireland
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