Adhesives for Electronics Assembly by DELO
DELO manufactures a range of high-purity adhesives tailored for electronic applications, including UV & heat-cured epoxies for encapsulating devices or assemblies (whether by GlobTop Or Dam & Fill processing), silicones, plus light-activated and light-cured products for encapsulation, sealing and joining.
For information on some of the ways that adhesives are used in electronic applications, please look at our Knowledge Based Fact Sheet here.
Some applications include:
Adhesives used to bond the MEMS device to the substrate must be highly stress-relieving.
Odd-Form Component Fixing
Some demanding applications require tall, odd-form components to be bonded to the PCB after solder reflow.
LED Lens Bonding
A range of optically-clear adhesives that offers very low outgassing.
Relay Pin Sealing
Relays are enclosed in plastic to provide resistance and need to be sealed.
DELO’s new family of optically-clear adhesives are highly transparent with no yellowing.
Silicon Wafer Manufacturing
Cutting individual wafers from silicon ingots is a delicate operation.
Tel: +44 (0)1264 334505
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland