Fill-Level Sensor Encapsulation
DELO-GUM Key Features
- Industrial grade silicone adhesives and sealants
- One-part moisture-cured
- Excellent temperature, chemical and aging resistance
- High purity versions ideal for electronic applications
DELO-GUM silicone adhesives are used to encapsulate PCBs in PolyOxyMethylene (POM) plastic housings. The end-device is used to monitor fill-level sensors on gas canisters.
These one-part adhesives provide good adhesion both to the POM housing and the FR4 within, and also reliably seal the components from the gas being measured. In addition, because there is a neutral cross-linking of the adhesive, there is no potential for corrosion of the electronic components.
DELO’s silicone sealants are easy to dispense from 310ml Eurocartridges, and curing at RT at a rate of 2mm / 24hrs means that there is no need for an additional curing process (such as heat or UV light).
Knowledge Base Articles
Adhesives for PCBs (IKB-040)
Encapsulation Adhesives (IKB-013)
Basic Adhesive Types (IKB-041)
How to Choose the Right Adhesive (IKB-035)
All Things Considered (IKB-042)
Tel: +44 (0)1264 334505
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland