Fill-Level Sensor Encapsulation

DELO-GUM Key Features

  • Industrial grade silicone adhesives and sealants
  • One-part moisture-cured
  • Excellent temperature, chemical and aging resistance
  • High purity versions ideal for electronic applications

DELO-GUM silicone adhesives are used to encapsulate PCBs in PolyOxyMethylene (POM) plastic housings. The end-device is used to monitor fill-level sensors on gas canisters.

These one-part adhesives provide good adhesion both to the POM housing and the FR4 within, and also reliably seal the components from the gas being measured. In addition, because there is a neutral cross-linking of the adhesive, there is no potential for corrosion of the electronic components.

DELO’s silicone sealants are easy to dispense from 310ml Eurocartridges, and curing at RT at a rate of 2mm / 24hrs means that there is no need for an additional curing process (such as heat or UV light).

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Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.


Available from Inseto in the United Kingdom & Ireland

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