MEMS Packaging Key Features
- Highly flexible, stress-relieving
- High bond strength
- Short processing times
MicroElectroMechanical Systems (MEMS) are found in a very wide variety of applications, from smart phones to military gyroscopes. These are usually measuring minute relative changes in the surrounding environment, so the adhesive used to bond the MEMS device to the substrate must be highly stress-relieving, in order that the adhesive itself doesn’t induce stress into the MEMS device. DELO has developed a range of highly flexible adhesives that also offers high bond strength, a very unusual combination that has in the past proved extremely difficult to master.
A typical MEMS device consists of a MEMS IC + ASIC IC, both adhesive-bonded onto the substrate. The ASIC is then encapsulated, before the complete assembly is covered with a lid. These four separate applications require very different types of adhesives:
MEMS IC Adhesive
This is the most critical application, because the MEMS die must be as insulated as possible from the substrate to which it is bonded. The adhesive needs to have a high flexibility (Young’s Modulus ~ 5 MPa), high shear strength, and short processing time, for example curing at 100°C for 15 minutes, as most MEMS devices are manufactured in very high volumes.
ASIC IC Adhesive
Typical die attach adhesives are used for this, such as can be found here on the Die Attach Adhesives page. The adhesive should ideally be fast curing at low temperatures.
ASIC Encapsulation Adhesive
Typically this too will be a highly flexible adhesive. It should also be jettable, and have a fast processing time, for example, curing in 15 minutes at 100°C.
This adhesive needs to have a very high impact resistance to protect the sensitive components in the MEMS package. As most lids are metal, the adhesive needs to bond well to gold, nickel, and stainless steel. It should also have a high electrical conductivity due to its EMC shielding requirement. DELO DUALBOND IC343 is a typical example of this type of adhesive.
Tel: +44 (0)1264 334505
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland