Silicon Wafer Manufacturing
DELO-DUOPOX Key Features
- Fast curing at room temperature
- Low-high viscosities and gap-fill versions available
- Uniform stress distribution with long-term durability
- Excellent adhesion to similar and dissimilar substrates
Cutting individual wafers from silicon ingots is a delicate operation, as the ingot needs to be held in such a way that the silicon is not damaged. This is achieved by using a removable DELO-DUOPOX two-part epoxy to bond the ingot onto a glass substrate. After the adhesive is cured, the ingot is cut into the individual wafers by an EDM process. The adhesive is then removed by immersing the assembly into a 15% formic acid solution, at 80C, for three minutes. This ensures optimal yields for the wafers.
Knowledge Base Articles
Adhesives for PCBs (IKB-040)
Basic Adhesive Types (IKB-041)
How to Choose the Right Adhesive (IKB-035)
All Things Considered (IKB-042)
Tel: +44 (0)1264 334505
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland