Adhesives for Microelectronic Applications by DELO
DELO manufactures a range of high-purity adhesives tailored for microelectronic applications, including conductive and non-conductive die attach adhesives, glob-top encapsulation materials and anisotropic adhesives etc.
To view our full range range of Adhesive’s for die attach and glob top encapsulation, please click HERE.
Adhesives used to bond the MEMS device to the substrate must be highly stress-relieving.
Conductive Die Attach Adhesives
Silver-loaded adhesives are used to provide an isotropic electrical connection to the die when bonded.
Anisotropic Conductive Die Attach Adhesives
Z-axis, or anisotropic conductive, adhesives are used to bond flip-chips and BGAs onto a wide varierty of substrate materials.
Thermally Conductive Die Attach Adhesives
DELO MONOPOX adhesive provide thermal conductivity and electrical isolation for high-reliability applications.
Non-Conductive Die Attach Adhesives
Non-conductive die attach adhesives are cost-effective and provide flexible bonding capabilities.
Glob Top Encapsulation Adhesives
Glob Top adhesives are used to protect small die, generally in an area that is < 2mm x 2mm.
Dam & Fill Encapsulation Adhesives
For larger area (> 2mm x 2mm), a two-stage process is required. A Dam is dispensed prior to Filling the area created by the Dam.
Tel: +44 (0)1264 334505
Die Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland