Inseto

Adhesives for Microelectronic Applications by DELO

DELO manufactures a range of high-purity adhesives tailored for microelectronic applications, including conductive and non-conductive die attach adhesives, glob-top encapsulation materials and anisotropic adhesives etc.

To view our full range of Adhesive’s for die attach and glob top encapsulation, please click HERE.

DELO

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

DELO Website

www.delo-adhesives.com

Region

Available from Inseto in the United Kingdom & Ireland

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