Inseto
Inseto

Adhesives for Microelectronic Applications by DELO

DELO manufactures a range of high-purity adhesives tailored for microelectronic applications, including conductive and non-conductive die attach adhesives, glob-top encapsulation materials and anisotropic adhesives etc.

To view our full range range of Adhesive’s for die attach and glob top encapsulation, please click HERE.

DELO

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

DELO Website

www.delo-adhesives.com

Region

Available from Inseto in the United Kingdom & Ireland

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