Adhesives for Microelectronic Applications by DELO
DELO adhesives are used in a vast range of microelectronic applications including die attach, IC encapsulation including Dam & Fill, plus light-activated and light-cured adhesives for casting, sealing and joining.
Detailed below are some examples, however if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has already been solved.
Tel: +44 (0)1264 334505
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection against Vibration, Conductive Electrical Connection, Under-fill, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland