PA – Metal Pin Relay Housing
DELO MONOPOX Key Features
- One-part materials that require no mixing
- Curing temperatures from 60°C
- Excellent temperature and chemical resistance
- Electrically conductive and non-conductive versions
DELO DUALBOND Key Features
- Initial cure with light for handling or securing
- Full cure with light or heat or moisture
- Ideal for applications with shadow zones
- Excellent adhesion to many substrate materials
Typically in a sealing application like this, an adhesive with excellent flowing behaviour and very good wetting is required. In addition, the adhesive also needs to have high humidity resistance and be able to withstand temperature extremes. For devices that have shadow areas in the bonding zone, a dual-curing adhesive with a secondary humidity-curing mechanism can be used.
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Knowledge Base Articles
Description
Description
Dual Cured Adhesives (IKB-012)
Link
Description
Basic Adhesive Types (IKB-041)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
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All Things Considered (IKB-042)
Link
Description
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Link
Further Information
Applications
Quick High Strength Bonding, Securing, Sealing, Joining
Industry Segments
Plastics & Rubber Processing, Electronics / Electrical Engineering etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
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