PA - Metal Pin Relay Housing

DELO MONOPOX Key Features

One-part materials that require no mixing
Curing temperatures from 60°C
Excellent temperature and chemical resistance
Electrically conductive and non-conductive versions

DELO DUALBOND Key Features

Initial cure with light for handling or securing
Full cure with light or heat or moisture
Ideal for applications with shadow zones
Excellent adhesion to many substrate materials

Typically in a sealing application like this, an adhesive with excellent flowing behaviour and very good wetting is required. In addition, the adhesive also needs to have high humidity resistance and be able to withstand temperature extremes. For devices that have shadow areas in the bonding zone, a dual-curing adhesive with a secondary humidity-curing mechanism can be used.

More detailed information on the DELO MONOPOX range of adhesives can be found here, while information on DELO DUALBOND adhesives is here.