Inseto
Inseto

PA – Metal Pin Relay Housing

DELO MONOPOX Key Features

  • One-part materials that require no mixing
  • Curing temperatures from 60°C
  • Excellent temperature and chemical resistance
  • Electrically conductive and non-conductive versions

DELO DUALBOND Key Features

  • Initial cure with light for handling or securing
  • Full cure with light or heat or moisture
  • Ideal for applications with shadow zones
  • Excellent adhesion to many substrate materials

Typically in a sealing application like this, an adhesive with excellent flowing behaviour and very good wetting is required. In addition, the adhesive also needs to have high humidity resistance and be able to withstand temperature extremes. For devices that have shadow areas in the bonding zone, a dual-curing adhesive with a secondary humidity-curing mechanism can be used.

More detailed information on the DELO MONOPOX range of adhesives can be found here, while information on DELO DUALBOND adhesives is here.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Quick High Strength Bonding, Securing, Sealing, Joining

Industry Segments

Plastics & Rubber Processing, Electronics / Electrical Engineering etc.

Region

Available from Inseto in the United Kingdom & Ireland

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