Dual Cured Adhesive: DELO Dualbond
DELO Dualbond Key Features
- Dual cured adhesives
- Initial cure with light for handling or securing
- Full cure with light or heat or moisture
- Ideal for applications with shadow zones
- Optimum placement accuracy – no movement during secondary cure
- Excellent adhesion to many substrate materials
DELO DUALBOND dual cured adhesive are one-part adhesives suitable for bonding, sealing and potting applications. Based on either epoxy or acrylate chemistry, they have good resistance to thermal shock, and some products are optically clear for large-area bonding, especially suitable for display assembly.
They use a combination of light (UV or VIS) and either heat or humidity to achieve full cure. They are used in applications that require a very quick initial handling strength, with full cure being achieved off-line or in a subsequent process where cycle time is not so critical (e.g. in-line reflow ovens).
Using high-intensity light to fix the components in place eliminates any potential for movement of the parts relative to each other during the secondary heat or humidity cure.
Example dual cured adhesive applications include sealing compact camera modules, bonding RFID and smart labels and general applications in electronic assembly or other industries, which require short cycle times.
An example of an application that has been solved using a DELO DUALBOND dual cured adhesive can be found here. For information on choosing and working with dual-curing adhesives, please look at our Knowledge Base Fact Sheet here.
DELO Dualbond Technical Downloads
File
DELO DUALBOND – Dual Cured Adhesive Selection Chart
Download
File
DELO KATIOBOND / DELO DUALBOND Selection Chart
Download
File
DELO MONOPOX / DUALBOND Selection Chart
Download
File
DELO Light Curing Brochure
Download
File
DELO LED Curing Lamps Overview
Download
Example Applications
DELO Dualbond Product Range
Product
Viscosity
Description
Product
AD340
Viscosity
15,600
Description
Light & heat-cured mCD epoxy, beige, low-temperature (80°C) heat curing for shadow zones, bonds a wide range of materials
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Product
AD345
Viscosity
36,000
Description
Light & heat-cured mCD epoxy, beige, low-temperature (80°C) heat curing for shadow zones, particle size of d98 = 32µm
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Product
AD761
Viscosity
6,000
Description
Light & / or heat-cured epoxy, yellowish, translucent, extended pot life, flexible, low-temperature (130°C) heat curing for shadow zones, excellent chemical resistance
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Product
AD4930
Viscosity
14,000
Description
Light & humidity-cured acrylate, colourless, flexible, humidity curing for shadow zones, bonds a wide range of materials
Download
Product
AD4950
Viscosity
26,000
Description
Light & humidity-cured acrylate, colourless, extended pot life, highly flexible, humidity curing for shadow zones
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Product
BS3770
Viscosity
115,000
Description
Light-fixable, heat-cured epoxy, beige, screen- & stencil printable, B-Stageable with 21 days possible between stages, highly flexible with very low Tg (-57°C)
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Product
GE731
Viscosity
17,000 thix
Description
Light & / or heat-cured epoxy, yellowish, translucent, extended pot life, flexible, low-temperature (130°C) heat curing for shadow zones, passes ANSI/UL 94 HB flame test
Download
Product
GE4707
Viscosity
1,500
Description
Light & / or heat-cured acrylate, blue, fluorescent, extended pot life, very highly flexible, low-temperature (110°C) heat curing for shadow zones
Download
Product
GE4906
Viscosity
2,200
Description
Light & humidity-cured acrylate, yellowish, fluorescent, extended pot life, very highly flexible, humidity curing for shadow zones
Download
Product
GE4910
Viscosity
2,100
Description
Light & humidity-cured acrylate, colourless, transparent, extended pot life, highly flexible, humidity curing for shadow zones
Download
Product
GE4919
Viscosity
20,000
Description
Light & humidity-cured acrylate, colourless, fluorescent, extended pot life, flexible, humidity curing for shadow zones
Download
Product
GE4931
Viscosity
7,000
Description
Light & humidity-cured acrylate, colourless, fluorescent, highly flexible, humidity curing for shadow zones, bonds a wide range of materials
Download
Product
GE4949
Viscosity
20,000
Description
Light & humidity-cured acrylate, black, extended pot life, flexible, humidity curing for shadow zones
Download
Product
GE7065
Viscosity
55,000
Description
GlobTop for IC Encapsulation, one-part, light-fixable (optional) & heat-cured, black, high Tg, low CTE (19ppm), wide operating temperature range (-65ºC – 220ºC), particle size of d95 = 7µm, MESL1 & UL94 compliant
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Product
IC343
Viscosity
42,000 thix
Description
Light & heat-cured electrically conductive mCD epoxy, silver grey, low temperature (80C°) heat curing for shadow zones
Download
Product
IC4753
Viscosity
30,000 thix
Description
Light & heat-cured electrically conductive acrylate, silver grey, low temperature (80C°) heat curing for shadow zones, flexible – 70% elongation
Download
Product
LT354
Viscosity
145,000 thix
Description
Light & heat-cured mCD epoxy, grey, low-temperature (80°C) heat curing for shadow zones, particle size of d95 = 21µm
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Product
LT2208
Viscosity
1,500
Description
Light & heat-cured epoxy, yellowish, flexible, very low-temperature (60°C) heat curing for shadow zones, very low water absorption, particle size of d95 = 15µm
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Product
LT2266
Viscosity
50,000 thix
Description
Light & heat-cured epoxy, black, flexible, very low-temperature (60°C) heat curing for shadow zones, very low water absorption
Download
Product
LT2345
Viscosity
65,000
Description
Light & heat-cured epoxy, orange, complies with NASA outgassing requirements, low-temperature (80°C) heat curing for shadow zones, very low water absorption, ideal for bonding to nickel
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Product
LT3368
Viscosity
150,000
Description
Light & heat-cured epoxy, gray, low-temperature (80°C) heat curing for shadow zones, very low water absorption
Download
Product
MF4992
Viscosity
100,000 thix
Description
Light & humidity-cured acrylate, red, fluorescent, extended pot life, flexible, humidity curing for shadow zones, excellent peel resistance
Download
Product
OB749
Viscosity
14,000
Description
Light & / or heat-cured epoxy, white, translucent, complies with NASA outgassing requirements, low-temperature (80°C) heat curing for shadow zones, ideal for use in electronic applications
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Product
OB786
Viscosity
32,000 thix
Description
UV & / or heat-cured epoxy, yellow, translucent, low-temperature (80°C) heat curing for shadow zones, extremely low water absorption, bonds a very wide range of materials
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Product
OB787
Viscosity
46,800 thix
Description
Light & / or heat-cured epoxy, yellowish, fluorescent, low-temperature (80°C) heat curing for shadow zones, very low water absorption, bonds a very wide range of materials
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Product
OB6769
Viscosity
23,000
Description
Light & / or heat-cured epoxy, whitish, fluorescent, complies with NASA outgassing requirements, low-temperature (80°C) heat curing for shadow zones, particle size of d95 = 12µm, very low water absorption
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Product
RE3440
Viscosity
16,000
Description
Light & heat-cured mCD epoxy, black, low-temperature (80°C) heat curing for shadow zones, bonds a very wide range of materials
Download
Product
SJ2718
Viscosity
24,000
Description
Light & heat-cured epoxy, beige, extended pot life, low-temperature (90°C) heat curing for shadow zones, ideal for bonding to rubber and hi-temp plastics
Download
Product
SJ4765
Viscosity
14,500 thix
Description
Light & heat-cured epoxy, red, fluorescent, extended pot life, highly flexible, bonds to a wide range of materials
Download
Product
SL4955
Viscosity
35,000
Description
Light & humidity-cured acrylate, colourless, transparent, extended pot life, very low Tg (-58°C)
Download
Product
SR4991
Viscosity
56,000 thix
Description
Light & humidity-cured acrylate, red, fluorescent, extended pot life, highly flexible
Download
Product
SR4995
Viscosity
40,000 thix
Description
Light & humidity-cured acrylate, red, fluorescent, extended pot life, highly flexible, very good peel strength
Download
Related Products
Light-Cured Acrylates
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Light-Cured Epoxies
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Light-Activated Adhesives
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UV Curing Equipment
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Plasma Cleaning & Etching Equipment
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Knowledge Base Articles
Description
Description
Dual Cured Adhesives (IKB-012)
Link
Description
Lamps for Curing UV Adhesives (IKB-074)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Description
Adhesives for PCBs (IKB-040)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Further Information
Applications
Bonding, Sealing, Encapsulation in Shadow Zones or where a quick initial handling strength is required; High-Accuracy Component Placement; Automotive Camera Assembly; Protection Against Chemicals; Temperature-Sensitive Substrates
Industry Segments
Ink Jet Print Heads, Electronics, Microelectronics, Automotive, Mobile Communications, LEDs, Display Bonding & Sealing, Loudspeakers, Plastic & Glass Processing etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
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