Light Activated Adhesive
DELO Katiobond & DELO Photobond Key Features
- Light activated adhesive range
- For bonding non-transparent parts
- Fast-curing adhesives, resulting in short cycle-times
- Excellent chemical resistance
- One-part adhesives, ideal for manual or automated processing
- Excellent performance over wide temperature range
Light Activated Adhesive: Under normal circumstances, it is not possible to bond non-transparent parts together with traditional light-cured adhesives, as 100% of the adhesive cannot be illuminated, leaving un-cured adhesive between the parts being bonded. DELO’s light-activated adhesives are the solution. Simply apply the adhesive onto the base substrate; activate with high-intensity light for a short period of time (< 20s); within the resulting open-time of the adhesive (i.e. before a skin forms on the adhesive surface), place the other substrate onto the adhesive. Full cure is achieved after 24 hours.
To reduce the waiting time, heat can be applied to accelerate the cure. Alternatively, if there is a fillet around the edge of the joint, illuminating this fillet with high-intensity light achieves handling strength within seconds.
Activated with visible (400-550nm) light, DELO KATIOBOND and DELO PHOTOBOND are one-part adhesives that cure at room temperature. The light activated adhesives are especially suitable for bonding, sealing and potting applications.
They also have good temperature resistance, up to 180°C, and excellent chemical resistance, making them ideal for automotive and harsh environment use. Cured products exhibit low shrinkage, resulting in low stress on delicate devices. Low water absorption and very low ionic content make them ideal for electronic applications.
For information on choosing and working with light activated adhesive’s, please look at our Knowledge Base Fact Sheet here.
Example Applications
Light-Activated Adhesives Product Range
Product
Viscosity
Description
Product
554
Viscosity
1,500
Description
Light-activated epoxy (7s activation ≈ 20s open time), yellow/fluorescent, good flow, elastic, tension equalising
Download
Product
4552
Viscosity
1,200
Description
Light-activated epoxy (3s activation ≈ 21s open time), yellow, excellent flow, tough bond, fast curing
Download
Product
4578
Viscosity
3,000 thix
Description
Light-activated epoxy (3s activation ≈ 18s open time), yellow, medium viscosity, very good adhesion to plastics
Download
Product
4594
Viscosity
5,500 thix
Description
Light-activated epoxy (3s activation ≈ 20s open time), yellowish, good for gap filling, tough bond, excellent adhesion to plastics
Download
Product
45952
Viscosity
6,300 thix
Description
Light-activated epoxy (8s activation ≈ 18s open time), yellow, fluorescent trace, tough elastic
Download
Product
DI6049
Viscosity
20,000 thix
Description
Light-activated epoxy (10s activation ≈ 2-10m open time), whitish / translucent, low CTE (18ppm), high Tg (170°C), thermally conductive, excellent chemical resistance
Download
Product
LA4860
Viscosity
70,000 thix
Description
Light-activated acrylate (6s activation ≈ 25s open time), colourless, fluorescent
Download
Product
LA4880
Viscosity
70,000 thix
Description
Light-activated acrylate (6s activation ≈ 20s open time), humidity cured, whitish / translucent, fluorescent, highly flexible, ideal for bonding non-transparent materials
Download
Product
LA4899
Viscosity
200,000 thix
Description
Light-activated acrylate (6s activation ≈ 30s open time), colourless, fluorescent, highly flexible, ideal for bonding non-transparent materials
Download
Related Products
Light-Cured Acrylates

More
UV & Light Curing Adhesive

More
Dual-Cured Adhesives

More
UV Curing Equipment

More
Plasma Cleaning & Etching Equipment

More
Knowledge Base Articles
Description
Description
Light Activated Adhesives (IKB-045)
Link
Description
Lamps for Curing UV Adhesives (IKB-074)
Link
Description
Basic Adhesive Types (IKB-041)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Description
Adhesives for PCBs (IKB-040)
Link
Description
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Link
Further Information
Applications
Bonding, Sealing, Encapsulation; Anti-Vibration; Sensor Sealing; Electronic Component Assembly
Industry Segments
Communications, Electronics, Automotive, Opto-Electronics, Smart Card, RFID, Plastic & Glass Processing etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
Request Form