Heat-Cured Epoxies: DELO Monopox
DELO Monopox Key Features
- Single-part epoxy adhesives that require no mixing
- Curing temperatures from 60°C
- Excellent temperature and chemical resistance
- Electrically conductive and non-conductive versions
- Thermally conductive, low temperature curing (60ºC) version also available
DELO MONOPOX epoxies are one-part, heat-cured epoxy resin adhesives for bonding, casting and sealing of joints. These epoxy resin adhesives are high-strength materials that can be used as alternatives to riveting, welding and brazing in high stress applications.
Epoxies exhibit excellent adhesion to metals, ferrites and ceramics. Special advantages of epoxies include their resistance to temperature, chemicals and low water absorption. They will also protect against corrosion.
The epoxy resin is supplied ready to use with no mixing required. Curing occurs in 15-75 minutes @ 60-180°C. Versions are available with good flow properties or with high run-off resistance.
Examples of applications that have been solved with DELO MONOPOX adhesives can be found here.
DELO Monopox Technical Downloads
File
DELO MONOPOX Adhesives Selection Chart
Download
File
DELO Heat Curing Brochure
Download
File
DELO Structural Bonding Brochure
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Example Applications
DELO Monopox Structural Adhesives Product Range
Product
Viscosity
Description
Product
AC268
Viscosity
28,000
Description
Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 < 5µm), fast curing (6s) by thermode, excellent adhesion to FR4 & PET
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Product
AC6545
Viscosity
42,500
Description
Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 = 5µm), fast curing (1s) by thermode, excellent adhesion to FR4 & PET
Download
Product
AC6568
Viscosity
95,000 thix
Description
Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 = 5µm), fast curing (1.5s) by thermode, excellent adhesion to FR4 & PET
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Product
EG2596
Viscosity
70,000 thix
Description
Non-conductive die attach epoxy, heat-cured (90°C minimum), red, fluorescent, ideal for bonding to nickel, gold & FR4
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Product
HT2860
Viscosity
110,000 thix
Description
Epoxy, heat-cured (150°C minimum), grey, very high bonding strength, extended pot life, wide operating temperature range (-55°C – 220°C), meets requirements of UL94 HB
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Product
HT2999
Viscosity
Pasty
Description
Epoxy, heat-cured (150°C minimum), grey, very high bonding strength, extended pot life, wide operating temperature range (-55°C – 220°C), low CTE (30ppm/°K), high Tg (180°C)
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Product
LT2224
Viscosity
20,000
Description
Epoxy, heat-cured, white, fluorescent, flexible, low-temperature curing (60°C), low particle size of d50 = 15µm, bonds a wide range of materials
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Product
LT2238
Viscosity
21,000
Description
Epoxy, heat-cured, black, low-temperature curing (60°C), low particle size of d98 = 15µm, bonds a wide range of materials
Download
Product
SJ2735
Viscosity
50,000
Description
Epoxy, heat-cured (90°C minimum), colourless, extended pot life, very high bonding strength, construction adhesive
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Product
SJ2981
Viscosity
Pasty
Description
Epoxy, heat-cured (150°C minimum), beige, extended pot life, very high bonding strength, wide operating temperature range (-55°C – 200°C)
Download
Product
TC2270
Viscosity
140,000 thix
Description
Epoxy, heat-cured (60°C minimum), grey, thermally conductive, low CTE, operating temperature range of -40°C – 150°C
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DELO Monopox Casting Resins Product Range
Product
Viscosity
Description
Product
GE2710
Viscosity
8,000
Description
Fill for IC Encapsulation, one-part, heat-cured @ 100°C, black, fluorescent, long pot life, very high bond strength to FR4, excellent flowing behaviour
Download
Product
GE6525
Viscosity
18,000
Description
Fill for IC Encapsulation, one-part, heat-cured @ 100°C, black, high Tg, very low CTE (13ppm), wide operating temperature range (-65ºC – 200ºC), MESL1 & UL94 compliant, excellent flowing behaviour
Download
Product
GE6585
Viscosity
165,000
Description
Dam for IC Encapsulation, one-part, heat-cured @ 100°C, black, high Tg, very low CTE (11ppm), wide operating temperature range (-65ºC – 200ºC), MESL1 & UL94 compliant
Download
Related Products
Knowledge Base Articles
Description
Description
Basic Adhesive Types (IKB-041)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Description
Encapsulation Adhesives (IKB-013)
Link
Description
Likely Changes To Chip Encapsulation Adhesives (IKB-079)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Link
Further Information
Applications
Structural Adhesives – High Strength Mechanical Joining (Can Replace Soldering or Rivets); Casting Resins – Casting & Potting; Microelectronics – Die Bonding and Encapsulation for Chip-& Wire; Low Temperature Bonding for Temperature-Sensitive Substrates
Industry Segments
Electronics, Microelectronics, Consumer Electronics, Automotive Engineering, Mechanical Engineering, Construction Industries, Metal Processing, RFID & Smart Card
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
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