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Inseto

Heat-Cured Epoxies: DELO Monopox

DELO Monopox Key Features

  • Single-part epoxy adhesives that require no mixing
  • Curing temperatures from 60°C
  • Excellent temperature and chemical resistance
  • Electrically conductive and non-conductive versions
  • Thermally conductive, low temperature curing (60ºC) version also available

DELO MONOPOX epoxies are one-part, heat-cured epoxy resin adhesives for bonding, casting and sealing of joints. These epoxy resin adhesives are high-strength materials that can be used as alternatives to riveting, welding and brazing in high stress applications.

Epoxies exhibit excellent adhesion to metals, ferrites and ceramics. Special advantages of epoxies include their resistance to temperature, chemicals and low water absorption. They will also protect against corrosion.

The epoxy resin is supplied ready to use with no mixing required. Curing occurs in 15-75 minutes @ 60-180°C. Versions are available with good flow properties or with high run-off resistance.

Examples of applications that have been solved with DELO MONOPOX adhesives can be found here.

DELO Monopox Structural Adhesives Product Range

Product

Viscosity

Description

Product

AC245

Viscosity

33,000

Description

Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 < 5.3µm), fast curing (6s) by thermode, excellent adhesion to FR4 & PET

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Product

AC265

Viscosity

26,000

Description

Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, filled with gold-over-nickel-polymer balls (d50 < 2.5µm), fast curing (6s) by thermode, excellent adhesion to FR4 & PET

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Product

AC268

Viscosity

28,000

Description

Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 < 5.3µm), fast curing (6s) by thermode, excellent adhesion to FR4 & PET

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Product

AD286

Viscosity

140,000 thix

Description

Epoxy, heat-cured (130°C minimum), silver grey, very high bonding strength, extended pot life, wide operating temperature range (-55°C – 200°C), meets requirements of UL94 HB

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Product

DA255

Viscosity

33,000

Description

Non-conductive die attach epoxy, heat-cured (90°C minimum), grey, suitable for bonding to leadframes, FR4 & ceramic substrates

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Product

DA587

Viscosity

31,000 thix

Description

Non-conductive die attach epoxy, heat-cured (120°C minimum), white, suitable for bonding to leadframes, FR4 & epoxy tape used in Smart Card Technology

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Product

DA588

Viscosity

31,000 thix

Description

Non-conductive die attach epoxy, heat-cured (120°C minimum), blue, suitable for bonding to leadframes, FR4 & epoxy tape used in Smart Card Technology

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Product

HT2860

Viscosity

110,000 thix

Description

Epoxy, heat-cured (130°C minimum), light grey, very high bonding strength, extended pot life, wide operating temperature range (-55°C – 220°C), meets requirements of UL94 HB

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Product

LT204

Viscosity

28,000

Description

Epoxy, heat-cured, black, flexible, low-temperature curing (60°C), complies with NASA outgassing requirements, ideal for use in electronic applications

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Product

LT2224

Viscosity

20,000

Description

Epoxy, heat-cured, white, fluorescent, flexible, low-temperature curing (60°C), bonds a wide range of materials

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Product

LT2238

Viscosity

21,000

Description

Epoxy, heat-cured, black, low-temperature curing (60°C), bonds a wide range of materials

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Product

MK096

Viscosity

Pasty

Description

Non-conductive component-attach epoxy, heat-cured (120°C minimum), red, fast handling strength when cured at 150°C for 60 seconds

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Product

SJ2735

Viscosity

50,000

Description

Epoxy, heat-cured (90°C minimum), colourless, very high bonding strength, ideal for bonding to rubber and hi-temp plastics

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Product

SJ2981

Viscosity

Pasty

Description

Epoxy, heat-cured (120°C minimum), beige, extended pot life, very high bonding strength, wide operating temperature range (-55°C – 220°C),

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Product

TC2270

Viscosity

140,000

Description

Epoxy, heat-cured (60°C minimum), grey, thermally conductive, low CTE, operating temperature range of -40°C – 150°C

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DELO Monopox Casting Resins Product Range

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Structural Adhesives – High Strength Mechanical Joining (Can Replace Soldering or Rivets), Casting Resins – Casting, Potting & Encapsulation

Industry Segments

Electronics, Automotive Engineering, Mechanical Engineering, Construction Industries, Metal Processing

Region

Available from Inseto in the United Kingdom & Ireland

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