Inseto
Inseto

Knowledge Base Fact Sheet

Ball Bond Sequence (IKB-001)

Explanation of the ball bonding cycle for ultrasonically welding electrical interconnects in microelectronics.

The Ball Bond sequence for both manual and automatic wire bonding machines can be explained in seven steps:

Ball Bond Sequence
Ball Bond Sequence

  • STEP 1: BALL FORMATION: Spark from EFO wand melts wire to form ball for first bond.
  • STEP 2: FIRST BOND: Ball bond ready to commence. Tool brought over first bond position (X, Y) and down into contact with surface – force is pre-set value – ultrasonic energy applied for pre-set time to form first bond.
  • STEP 3: LOOP HEIGHT: Tool is raised to pay wire out from spool (clamps open) to loop height value.
  • STEP 4: LOOP FORMATION: Tool moved to second bond position (manually or automatically).
  • STEP 5: SECOND BOND: Tool brought into contact with surface – second bond made as step 2.
  • STEP 6: TERMINATION: Following 2nd bond, tool moves up to pre-set height (tail), clamps close and break off wire at 2nd bond heel.
  • STEP 7: BALL FORMATION: Automatic repeat of step 1 to begin cycle again.

For further information on our range of MPP Manual Wire Bonders, please click HERE.

For further information on our range of Kulicke and Soffa Automatic Ball Bonders, please click HERE.

For further information on our range of wirebonding materials, please click HERE.

For further information on our range of wirebonding capillaries, please click HERE.

Author

Date

Version

Author

Jim Rhodes

Date

22 May 2017

Version

IKB001 Rev. 3

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