Inseto
Inseto

Category Archives: Consumables

SOI Wafer Key Features

  • PRIME grade high-quality SOI wafer
  • Exceptional device layer TTV control
  • 3” to 200mm wafers available
  • Bonded SOI from device layers of 1.5um to >300um
  • Any dopant and Si orientation
  • Backside with oxide coating and laser marking available
  • Supply and Shipment Worldwide from Stock or on short lead times

Inseto is a specialist in supplying Bonded SOI (BSOI) wafer with device layer thickness of >1.5um and exceptional device layer TTV and flatness. Wafers sizes from 3” to 200mm can be made in short lead-times and small lot sizes are also available.

Direct Si-Si bonded wafers and Double bonded SOI are also available, along with thick device layers>300um, Box thickness 0.5-10um, and any dopant or orientation. We can also have wafers with oxide on the backside as well as laser marking on front or backside.

Our high-quality Si Wafers are shipped and used worldwide by University and Industrial Research, Manufacturing and equipment manufacturers. Please do not hesitate to contact our support team for application and technical advice, if you need assistance specifying your wafers.

Product range overview

SOI Wafers:

  • SOI Wafer sizes from 3” to 200mm, some in inventory
  • Very high quality with tight TTV on device layer thickness
  • Direct Si-Si bonding and double sided SOI available
  • Any Si orientation, any device thickness over 1.5um
  • Single and double side polished
  • Small lot sizes and Laser marking of wafers available
  • Short lead time delivery
  • SOI Wafers in Process

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

Request Form

ATP offers an assortment of products for different applications. These include inductor coils that have been modeled and optimised using advanced CAD tools to produce data and graphs to help engineers utilise these devices in their own thin-film or hybrid designs. These printed inductors can be used in a wide variety of applications from DC and RF filtering to gain shaping and equalisation circuits. Engineering kits are available which contain the entire product line in one complete package to meet all prototyping needs.

ATP also offers three different types of 50Ω transmission lines: single line, single line with two rows of tuning pads, and single line with four rows of tuning pads. ATP Transmission Lines have a fixed width and adjustable lengths, and no mask purchase is required. Lines are continuous and can therefore be diced to any size. In-stock lengths are in 0.010″ (0.254mm) increments, up to 0.500″ (12.70mm). There is no pull-back in the design, so parts may occasionally have burrs / tails since dicing is carried out through the gold. Engineering kits are also available.

Stand-offs & Isolation Pads can be used as a capacitive standoff, component mounting isolation pad, landing pads to reduce bond wire and DC bias wire lengths, gap pedestals for aligning component heights, and many other useful configurations. There is no pull-back in the design, so parts may occasionally have burrs / tails since dicing is carried out through the gold.

Bond pad test coupons are a platform that allows for organising and tracking wirebond pull data on a daily and monthly basis. The coupon is designed as a calendar to maintain daily & monthly test results of each wirebonder on the assembly line. Each pad maintains the bond pulls done on a daily basis, allowing a new set of bonds to be added each day throughout the month. The coupon offers the ability to mark or scribe specific information on it such as the month samples are from and which wirebonder they were performed on. 

Surface finish and bond strength are key attributes of good quality metalisation. ATP offers the opportunity to evaluate a wide range of metalisation schemes on different substrate materials so that customers can see in advance the quality of the product on offer from ATP.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

ATP Website

www.thinfilm.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

To simplify the process as much as possible, ATP offers design guidelines on a range of topics. Information on their standard manufacturing dimensions and tolerances can help at the very early stages of the customer design, knowing what is achievable using standard materials processes and thereby minimising costs. Detailed CAD pointers allow customer designs to be imported directly into ATP’s in-house CAD system.

ATP’s thin film design rules contain the fundamental design rules that must be followed in order for the product to be compatible with ATP’s processing techniques. ATP also offers customer assistance by defining the design rules for laser trimming TaN resistors on thin film circuits.

As a reference to the thermal performance of TaN resistors, ATP has produced data that gives the circuit designer an insight into the surface temperature distribution both through an alumina substrate and across a square resistor. In addition, a series of equations is available that investigates the aging equation of TaN resistors.

Just as with TaN resistors, ATP offers similar assistance when working with Polyimide bridges, with a complete set of design rules available for the design stage of the circuit.

For aluminium nitride substrates, thermal dissipation is rarely an issue! However, this is not always the case with alumina substrates. Track width and thickness assume much greater importance for alumina, and so ATP offers information on safe current limits for both gold and copper tracks on alumina substrates, assisting the designer in choosing a safe bias current level.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

ATP Website

www.thinfilm.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

ATP makes its own hard surface photomasks in a Class-100 chamber, produced on precision pattern-generated equipment. ATP routinely produces images in chrome and iron oxide on high-quality soda lime glass, and has extensive expertise in imaging on photographic emulsion. Masks are typically generated from AutoCAD, DWG or DXF files, and SolidWorks.

Sputtering is the deposition method of choice due to its superior adhesion. The basic metalisation scheme for thin film substrates contains TiW as the adhesion layer and Au as the conductor layer (TiW/Au). Solderable metalisation is achieved by adding Ni and / or Cu. Palladium can also be added as a solderable film when using high temperature eutectic solders such as the SAC products. The final combination depends on the customer application.

TaN resistor metalisation can be integrated onto substrates to allow for a wide range of resistivities – 10-200 Ω/Sq. The most cost-effective ones are 50, 75 & 100 Ω/sq. Resistor tolerances are dependant on material surface finishes and resistor design layout. ATP also offers laser trimming to tolerances as low as ±0.5%, or ±0.25 Ω, if required.

Computer-controlled lasers at ATP can create features of virtually any planar shape in ceramic substrates, and can deliver a positional accuracy of 0.001″ (0.0254mm) or better over areas as large as 8″x8″ (203.2mm x 203.2mm). The lasers are extremely flexible and permit close location of features with considerable layout flexibility. These shapes include circles, curves, rectangles, polygons, rounded thin slots, etc. 

Ion Beam Milling is a dry etching technique where the ions of an inert gas are accelerated from an ion source into the surface of the substrate in order to remove metals, providing an alternative to traditional wet etching methods. Because it is an anisotropic process, metal removal only occurs in the Z-axis, resulting in minimum undercutting of the underlying metals during the removal process, and achieving nearly-vertical sidewall profiles repeatedly.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

ATP Website

www.thinfilm.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

ATP’s technological capabilities include Polyimide-supported bridges, solder dams, laser diode submounts, plated and solid-filled Vias, edge wraps, and gold bumps.

Polyimide bridges provide a dramatically improved alternative to traditional wire bonding or standard air bridges. Because bridge height, length and overall placement are very consistent and durable, optimum performance can be easily repeated which can minimise or eliminate test and tune time. Typical bridge height is 3 – 6µm.

ATP offers photo-definable Polyimide and Metal solder dams. Polyimide is non-conductive. Typical metals include TaN, TiW, Ni & Pd.

ATP custom fabricates thin-film submounts with tightly controlled substrate and metal thicknesses, with pre-deposited and patterned AuSn, on highly thermally conductive AlN. The AuSn can be either sputtered or plated. Four standard test profiles are available in order to match as closely as possible the customer’s assembly process.

Via holes through the substrate material allow for connections between the top and bottom surfaces, allowing for a convenient means of obtaining a ground return through the substrate. Assembly concerns are addressed by eliminating epoxy and solder bleed onto the surfaces with either Polyimide or solid-filled Vias. Solid-filled Vias provide a low inductance ground path on both sides. Filled Vias can also act as a thermal pathway for two-sided signal interconnects.

Edge metalisation can be an alternative to Vias or slotted wraps. Edge-defined and indented edge wraps can be photo-definable.

ATP provides gold bumping for Flip Chip Assembly. These offer improved electrical performance at higher frequencies by inverting a compatible device directly onto the gold bumps. The bumps are a high-purity plated gold, made using a photolithographic process that ensures precise, repeatable placement onto the circuit.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

ATP Website

www.thinfilm.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Glass and Silica Wafer Key Features

  • Borosilicate or Alumino Silicate Glass & Fused Silica Wafer
  • Fused Quartz wafers, JGS2 and single crystal Quartz Wafers
  • Available in 2″ to 200mm Diameters or Rectangular Sizes
  • Double Side Polished, Thickness ≥200 µm
  • Custom Coatings, Processing and Dicing
  • Supply and Shipment Worldwide from Stock

Inseto supplies and stocks an extensive range of glass and fused silica wafer including Borosilicate glass, alumino silicate glass and fused silica. We offer a full dicing service on these glass wafers also with no minimum order quantity and a rapid turnaround on delivery.

  • Glass and fused silica wafers from 2” to 200mm dia from stock
  • Polished to 20/10 MIL standard for the smoothest surfaces
  • Edge rounded for safe secure handling
  • Pre-cleaned wafers available
  • No minimum order quantities
  • Wafer dicing available to any die size

Please do not hesitate to contact our support team for application and echnical advice, if you need assistance specifying your wafers.

Product range overview

Typical Glass and Silica Wafers:

Our in house expertise is available for you to use to define the process and materials that you need; let us know what you are working on and we are available to help you specify the correct materials.

  • Diameters: 2″ (50.8 mm), 3″ (76.2 mm), 100, 125, 150 and 200 mm
  • Also available in Square formats
  • Materials: Borofloat, Fused Silica and Quartz, JGS2, Single Xtal Quartz
  • Other materials include: BK7, Eagle XG, Soda Lime and B270
  • Thickness: ≥200 µm
  • Surface Finish: Single or Double Side Polished
  • Surface Quality (S/D): From 20/10 to 80/50
  • Surface Roughness: Ra 6-12 Å
  • Silica Wafers for Semiconductor and Related Research

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

Request Form

Coated Wafer Key Features

  • High Quality Oxide & Nitride Coated Wafer
  • Custom Coatings Thicknesses on Rapid Turnaround
  • Coating of Wafers with Au, Al, Pt Ni, Cr & Ti layers
  • Wafer Dicing Service for coated oxide and nitridge wafers
  • Supply and Shipment Worldwide from Stock

Inseto provides high quality oxide wafer and nitride wafer where either one or both surfaces have been coated with a controlled layer thicknesses.

Our oxide wafers (SiO2 Silicon Oxide) are coated using either atmospheric thermal oxide (ATOx), which always coats both sides of the wafer, dry Oxide that produces a thinner oxide layer but with a higher uniformity film and PECVD Oxide, which produces a coating on a single side of the wafer.

Our Nitride wafers (SiN – Silicon Nitride) are produced by using either PECVD, LPCVD or low stress LPCVD. These variants are changes in the method of deposition and alter the final physical and mechanical properties of the film.

A large percentage of wafers we ship are coated or processed in some way and we are able to offer a wide range of additional steps, to facilitate your onward processing. This service can save you substantial time in searching for suppliers of these layers yourself and our regular supply chain for this work enables rapid turnaround and advantageous pricing.

  • Thermally coated SiO2 Wafers from stock
  • LPCVD coated Si3N4 Wafers from stock
  • Customised coating thicknesses on rapid turnaround
  • Coating of wafers with Au, Al, Pt Ni, Cr & Ti layers
  • ALD coatings available
  • Patterning of wafers with location grids

Our in house expertise is available for you to use to define the process and materials that you need; let us know what you are working on and we are available to help you specify the correct materials.

Product range overview

Oxide and Nitride Coated Wafers:

Our in house expertise is available for you to use to define the process and materials that you need; let us know what you are working on and we are available to help you specify the correct materials.

  • Metalizations
  • PVD / CVD / Electroplating / Evaporating
  • Dry or Wet Thermal Oxide
  • Low Temperatore Oxide (LTO)
  • TEOS SiO2
  • LPCVD Nitride
  • PECVD Nitride
  • Polysilicon
  • Photoresist
  • Anti Sticking Layer
  • ITO (Indium tin oxide)
  • Removing SiO2 from wafer back side
  • Oxide Coated Silicon Wafers

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

Request Form

Silver-Pt/Pd Conductive Pastes Key Features

  • High leach resistance
  • Excellent solder resistance
  • Pb-free and Cd-free versions also available
  • Wide range of firing temperatures (450 – 850ºC)

Koartan manufactures a comprehensive range of Silver-Platinum, Silver-Palladium, Gold & Silver conductive thick-film pastes for a wide variety of Microelectronic Hybrid applications.

Koartan offers combinations of Silver Palladium and Silver Platinum with a range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.

The range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.

Gold pastes from Koartan are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

Thick Film Conductive Pastes Technical Downloads

File

Koartan Thick Print Gold Paper – IMAPS2002

Download

Silver Palladium & Platinum Thick Film Conductor Product Range

Part#

Type

Description

Part#

6225

Type

Solderable

Description

High Palladium content, excellent leach & silver migration resistance, fires at 850ºC

Download

Part#

6229

Type

Solderable

Description

Low cost, low resistivity, plateable conductor, fires at 850ºC

Download

Part#

6231

Type

High Pd Content

Description

Solderable, excellent leach resistance and adhesion, fires at 850ºC

Download

Part#

6241

Type

Medium Pd Content

Description

Excellent solder & leach resistance acceptance, used in fuel sender applications, fires at 850ºC

Download

Part#

6250-1 / 2

Type

Two Options

Description

Low & high viscosity for the coating of very small holes & castellations, fires at 850ºC

Download

Part#

6261

Type

Mid-Price

Description

Excellent solder adhesion, for industrial & automotive applications, fires at 850ºC

Download

Part#

6291

Type

High Performance

Description

Low resistivity, moderate cost, excellent solder acceptance & leach resistance, fires at 850ºC

Download

Part#

6292

Type

AlN AgPd

Description

High adhesion silver-palladium conductor for AlN, fires at 850ºC

Download

Part#

6296

Type

AgPd nano

Description

Nano particle-filled for solder-promoting, fires at 580 – 620ºC

Download

Part#

6305

Type

AgPt

Description

Excellent solder acceptance and leach resistance, fires at 850ºC

Download

Part#

6331

Type

AgPt

Description

Low cost, excellent leach resistance and low resistivity, fires at 850ºC

Download

Part#

6333

Type

AgPt

Description

Low cost, excellent solder acceptance and leach resistance, fires at 850ºC

Download

Part#

6410

Type

AgPtPd

Description

For low temperature resistive elements, economical conductor, fires at 850ºC

Download

Part#

6493

Type

AgPtPd

Description

For very demanding solder leach resistance requirements, fires at 850ºC

Download

Part#

6540

Type

Plug

Description

Very high solids paste for plugging holes in the substrate, fires at 850ºC

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Koartan Website

www.koartan.com

Region

Available througout Europe from Inseto

Request Form

Silver Conductive Pastes Key Features

  • Suitable for all processes – etchable, solderable, etc.
  • Wide range of firing temperatures (450 – 1,050ºC)
  • Thinners available for extended working life (information on-demand)

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Microelectronic Hybrid applications.

Their range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free products.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free materials.

Koartan Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

Thick Film Conductive Pastes Technical Downloads

File

Koartan Thick Print Gold Paper – IMAPS2002

Download

Silver Thick Film Conductor Product Range

Part#

Type

Description

Part#

6101

Type

Via Fill

Description

Low shrinkage paste for filling large via holes in multilayer dielectrics, fires at 850ºC

Download

Part#

6107

Type

High conductivity

Description

Termination metalisation on chip resistors, and for very small components, fires at 850ºC

Download

Part#

6111

Type

Plateable

Description

General purpose, excellent line resolution, suitable for RF applications, fires at 850ºC

Download

Part#

6120

Type

100% Ag

Description

Fine line, general purpose, inner multi-layer trace, fires at 850ºC

Download

Part#

6122

Type

AlN Silver

Description

High adhesion silver conductor for aluminum nitride (AlN), fires at 850ºC

Download

Part#

6125

Type

Low resistivity

Description

High solids content, thick printing for low resistivity applications, fires at 850ºC

Download

Part#

6130

Type

Thru-hole

Description

Thin, highly conductive coating for the inside of holes and castellations, fires at 850ºC

Download

Part#

6150

Type

Etchable

Description

High conductivity, 100% silver for etching fine lines, fires at 850ºC

Download

Part#

6160

Type

General purpose

Description

For high density microelectronic hybrid applications, fires at 850ºC

Download

Part#

6165

Type

High conductivity

Description

Low temperature firing, high electrical conductivity, fire at 500°C

Download

Part#

6165-SI

Type

Silicon silver

Description

Low temperature firing, for use on silicon substrates, high electrical conductivity, fires at 450°C

Download

Part#

6166

Type

Solderable

Description

Low temperature, high conductivity, for resistor terminations, fires at 600°C

Download

Part#

6168

Type

General purpose

Description

For cost sensitive applications, excellent conductivity and adhesion, fires at 850°C

Download

Part#

6550-1

Type

Etchable

Description

For very thin metalisation applications, multi-layer, fires at 850ºC

Download

Part#

6716

Type

Plasma silver

Description

For plasma displays, excellent adhesion to soda-lime glass, fires at 500ºC

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Koartan Website

www.koartan.com

Region

Available througout Europe from Inseto

Request Form

Aluminium Ribbon Key Features

  • High-purity aluminium for high power applications
  • Custom-manufactured to exacting specifications
  • Very tight dimensional tolerances of ±3%
  • Fewer connections required than wire results in reduced process time

Coining produces aluminium ribbon for high power applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge, resulting in significant reductions of machine downtime.

In high power applications that traditionally used aluminium wire, the advantage of switching to aluminium ribbon results in increased cycle times by reducing process times, achieved by eliminating the need for multiple wire bonds in devices. For example, 8 wire bonds of 125µm diameter can be replaced by 1 ribbon bond of 1mm x 100µm. Reducing the number of bonds also increases the reliability of the end product.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form